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BGW200 Datasheet, PDF (1/4 Pages) NXP Semiconductors – Low-power WLAN SiP | |||
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BGW200 Low-power
WLAN SiP
Complete, single-package 802.11b
solution for mobile handheld devices
Optimized for low-power mobile applications, this complete,
single-package 802.11b solution combines a baseband/MAC,
RF transceiver, and power ampliï¬er into an ultra-small
(150 mm2) package. It delivers the industryâs lowest power
consumption in standby mode and supports coexistence with
Bluetooth® solutions.
Semiconductors
The BGW200 is a complete, low-power 802.11b Wireless LAN (WLAN)
System-in-a-Package (SiP) solution optimized for battery-powered hand-
held devices. It enables consumers to connect to the growing number of
WLAN networks in ofï¬ces, homes, and public places. It also allows service
providers to increase their network reach and customer base, enabling
complementary data and voice services across cellular/PCS and WLAN
networks. Coexistence support for Bluetooth 1.1 and 1.2 enables seamless
integration with Philips Bluetooth solutions.
Key features
⢠Advanced, single-package WLAN SiP optimized for mobile handheld
devices
â No RF-critical design required
â Low total cost of ownership
⢠Lowest power consumption in standby mode: < 2 mW (typ)
⢠Ultra-small form factor
â Low-proï¬le 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm)
â Only three external components for entire solution
⢠âNo Host Loadâ design delivers easy integration and longer battery life
â Host processor sleeps while BGW200 processes beacons
â BGW200 wakes the host processor only upon data packet arrival
⢠Co-exists with Bluetooth 1.1 and 1.2
⢠Complete software drivers, utility, and diagnostic tools
Applications
⢠Smartphones, cellular phones,VoIP wireless phones
⢠PDAs, handheld computing devices,WLAN adapter cards (Secure Digital)
⢠Portable audio/video devices, MP3 players
⢠Other handhelds and electronic devices for wireless digital, audio, multi-
media, and telephony
The SiP format, with its complete system functionality, delivers quicker
design cycles, lower risk, simpliï¬ed manufacturing, and a reduced bill of
materials.The single-package format also simpliï¬es assembly and testing,
and reduces yield losses.The SiP delivers a complete, fully tested imple-
mentation of 802.11b functionality, so development teams can focus their
energy on innovative product design instead of solving complex issues
related to RF layout.
Ultra-small footprint, ultra-low power consumption
The BGW200 uses a single, 68-pin HVQFN-like package that measures
only 10 x 15 x 1.3 mm.The entire 802.11b solution requires only three
external components and uses less than 180 mm2 of circuit board area.
The BGW200 incorporates several features that decreases power con-
sumption.There is an integrated ARM7 processor, 1.25 Mbytes of SRAM,
256 Kbytes of ROM, optimized host interfaces (SDIO/SPI), and integrated
power management hardware/software algorithms.The result is the lowest
standby power consumption in the industry (less than 2 mW).
Superior âNo Host Loadâ Architecture
The BGW200 is designed to place no load on the host processor, so
mobile devices can integrate WLAN functionality without compromis-
ing application performance or battery life.The BGW200 only interfaces
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