AN10778 Datasheet, PDF (1/14 Pages) NXP Semiconductors – PCB layout guidelines for NXP MCUs in BGA packages

AN10778
PCB layout guidelines for NXP MCUs in BGA packages
Rev. 2 — 15 April 2011
Application note
Document information
Info
Content
Keywords
LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x,
LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,
LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478,
LPC2880, LPC2888, LPC3130, LPC3131, LPC3141, LPC3143,
LPC3152, LPC3154, LPC3180/01, LPC3220, LPC3230, LPC3240,
LPC3250, LH79524, LH7A400, LH7A404, TFBGA100, TFBGA144,
TFBGA208, TFBGA180, TFBGA296, LFBGA208, BGA256, LBGA256,
LFBGA256, LFBGA324, LFBGA320, Layout Guidelines, BGA, PCB, Fan-
out
Abstract
This application note is focused on Printed Circuit Board (PCB) layout
issues when using (L)(LF)(TF)BGA packages from the NXP LPC
Microcontroller family.