80C31X Datasheet, PDF (1/22 Pages) NXP Semiconductors – CMOS single-chip 8-bit microcontrollers

Philips Semiconductors
CMOS single-chip 8-bit microcontrollers
Product specification
80C31/80C51/87C51
DESCRIPTION
The Philips 80C31/80C51/87C51 is a high-performance
microcontroller fabricated with Philips high-density CMOS
technology. The CMOS 8XC51 is functionally compatible with the
NMOS 8031/8051 microcontrollers. The Philips CMOS technology
combines the high speed and density characteristics of HMOS with
the low power attributes of CMOS. Philips epitaxial substrate
minimizes latch-up sensitivity.
The 8XC51 contains a 4k × 8 ROM (80C51) EPROM (87C51), a 128
× 8 RAM, 32 I/O lines, two 16-bit counter/timers, a five-source,
two-priority level nested interrupt structure, a serial I/O port for either
multi-processor communications, I/O expansion or full duplex UART,
and on-chip oscillator and clock circuits.
In addition, the device has two software selectable modes of power
reduction—idle mode and power-down mode. The idle mode freezes
the CPU while allowing the RAM, timers, serial port, and interrupt
system to continue functioning. The power-down mode saves the
RAM contents but freezes the oscillator, causing all other chip
functions to be inoperative.
FEATURES
• 8031/8051 compatible
– 4k × 8 ROM (80C51)
– 4k × 8 EPROM (87C51)
– ROMless (80C31)
– 128 × 8 RAM
– Two 16-bit counter/timers
– Full duplex serial channel
– Boolean processor
• Memory addressing capability
– 64k ROM and 64k RAM
• Power control modes:
– Idle mode
– Power-down mode
• CMOS and TTL compatible
• Five speed ranges at V_CC = 5V
– 12MHz
– 16MHz
– 24MHz
– 33MHz
• Five package styles
• Extended temperature ranges
• OTP package available
PIN CONFIGURATIONS
P1.0 1
P1.1 2
40 _VCC
39 P0.0/AD0
P1.2 3
38 P0.1/AD1
P1.3 4
37 P0.2/AD2
P1.4 5
36 P0.3/AD3
P1.5 6
35 P0.4/AD4
P1.6 7
34 P0.5/AD5
P1.7 8
33 P0.6/AD6
RST 9
RxD/P3.0 10
TxD/P3.1 11
INT0/P3.2 12
CERAMIC
AND
PLASTIC
DUAL
IN-LINE
PACKAGE
32 P0.7/AD7
31 EA/V_PP
30 ALE/PROG
29 PSEN
INT1/P3.3 13
28 P2.7/A15
T0/P3.4 14
27 P2.6/A14
T1/P3.5 15
26 P2.5/A13
WR/P3.6 16
25 P2.4/A12
RD/P3.7 17
24 P2.3/A11
XTAL2 18
23 P2.2/A10
XTAL1 19
22 P2.1/A9
V_SS ²⁰
21 P2.0/A8
6
1
40
7
39
CERAMIC
AND
PLASTIC
LEAD
CHIP
CARRIER
17
29
18
28
44
34
1
33
PLASTIC
QUAD
FLAT
PACK
11
23
12
22
SEE PAGE 3-6 FOR QFP AND LCC PIN FUNCTIONS.
SU00001
1996 Aug 16
3-3
853–0169 17187