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74LVT_LVTH16244B_15 Datasheet, PDF (1/18 Pages) NXP Semiconductors – 3.3 V 16-bit buffer/driver; 3-state | |||
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74LVT16244B; 74LVTH16244B
3.3 V 16-bit buffer/driver; 3-state
Rev. 11 â 1 March 2012
Product data sheet
1. General description
The 74LVT16244B; 74LVTH16244B is a high-performance BiCMOS product designed for
VCC operation at 3.3 V.
This device is a 16-bit buffer and line driver featuring non-inverting 3-state bus outputs.
The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.
2. Features and benefits
ï® 16-bit bus interface
ï® 3-state buffers
ï® Output capability: +64 mA and ï32 mA
ï® TTL input and output switching levels
ï® Input and output interface capability to systems at 5 V supply
ï® Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs
ï® Power-up 3-state
ï® Live insertion and extraction permitted
ï® No bus current loading when output is tied to 5 V bus
ï® Latch-up protection
ïµ JESD78B Class II exceeds 500 mA
ï® ESD protection:
ïµ HBM JESD22-A114F exceeds 2000 V
ïµ MM JESD22-A115-A exceeds 200 V
3. Ordering information
Table 1. Ordering information
Type number
Package
Temperature range
74LVT16244BDL
ï40 ï°C to +85 ï°C
74LVTH16244BDL
74LVT16244BDGG ï40 ï°C to +85 ï°C
74LVTH16244BDGG
74LVT16244BEV
ï40 ï°C to +85 ï°C
Name
SSOP48
TSSOP48
VFBGA56
74LVT16244BBX
74LVTH16244BBX
ï40 ï°C to +125 ï°C
HXQFN60
Description
plastic shrink small outline package; 48 leads;
body width 7.5 mm
Version
SOT370-1
plastic thin shrink small outline package;
48 leads; body width 6.1 mm
SOT362-1
plastic very thin fine-pitch ball grid array
package; 56 balls; body 4.5 ï´ 7 ï´ 0.65 mm
SOT702-1
plastic compatible thermal enhanced extremely SOT1134-2
thin quad flat package; no leads; 60 terminals;
body 4 ï´ 6 ï´ 0.5 mm
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