SMD-VCTCXO Datasheet, PDF (4/4 Pages) PETERMANN-TECHNIK – HIGH RELIABILITY FOR LOW COST

Solder Reflow Profile:
Tp
T_L
Ts Max
Ts Min
Ramp-up
Critical Zone
T_L to Tp
Ramp-down
Ts Preheat
t 25℃ to Peak
Time (t)
t_L
t_p
High Temperature Infrared /Convection
Note:Temperature shown are applied to body of device
Ts max to T_L(Ramp-up Rate)
3°C/second max.
Preheat
150°C
Temperature Min(Ts Min)
175°C
Temperature Typical( Ts Typ)
200°C
Temperature Max.(Ts Max)
60-180 seconds
Time(ts)
Ram-up Rate(T_L to Tp)
3°C/second Max
Time Maintained Above:
--Temperature(T_L)
--Time(T_L)
217°C
60-150 seconds
Peak Temperature (Tp)
260°C max. for 10
seconds
Target Peak Temperature(Tp Target)
250°C+0/-5°C
Time within 5℃ of actual peak(t_p)
20-40 seconds
Ramp-down Rate
Tune 25℃ to Peak Temperature(t)
6°C/seconds Max
8 minutes Max
Moisture Sensitivity Level
Level 1
High Temperature Manual Soldering
Note:Temperature shown are applied to body of device
260°C max. for 5 seconds max., 2 times max.
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