PI6C4931504-04 Datasheet, PDF (6/6 Pages) Pericom Semiconductor Corporation – High Performance HCSL Fanout Buffer

PI6C4931504-04
High Performance HCSL Fanout Buffer
Notes:
1. Refer JEDEC MO-153F/AC
2. Controlling dimensions in millimeters
3. Package outline exclusive of mold flash and metal burr
12-0373
DESCRIPTION: 20-pin, 173mil Wide TSSOP
PACKAGE CODE: L
DOCUMENT CONTROL #: PD-1311
Note:
• For latest package info, please check: http://www.pericom.com/products/packaging/mechanicals.php
DATE: 05/03/12
REVISION: F
Ordering Information^(1-3)
Ordering Code
PI6C4931504-04LIE
Package Code
L
Package Description
20-pin, Pb-free & Green, TSSOP, (L20)
Notes:
1. Thermal characteristics can be found on the company web site at www.pericom.com/packaging/
2. E = Pb-free and Green
3. Adding an X suffix = Tape/Reel
12-0251
6

PI6C4931504-04
Rev A
08/14/2012