PI3B3245QEX Datasheet, PDF (4/5 Pages) Pericom Semiconductor Corporation – 3.3V, Hot Insertion, 8-Bit, 2-Port NanoSwitchTM

PI3B3245
3.3V, Hot Insertion, 8-Bit, 2-Port NanoSwitch^TM
Packaging Mechanical: 20-Pin QSOP (Q)
20
1
.337 8.56
.344 8.74
.058 REF
1.47
.150 _3.81
.157 _3.99
Guage Plane
.010
0.254
Detail A
.008
0.20
MIN.
.008
.013
0.20
0.33
.016
.035
0.41
0.89
.041
1.04
REF
0˚-6˚
DOCUMENT CONTROL NO.
PD - 1202
REVISION: H
DATE: 10/22/07
.053 1.35
.069 1.75
SEATING
PLANE
.015 x 45˚
0.38
Detail A
.007 0.178
.010 0.254
.025
BSC
0.635
.008 0.203
.012 0.305
.004 0.101
.010 0.254
X.XX DENOTES DIMENSIONS
X.XX IN MILLIMETERS
Note:
1) Controlling dimensions in inches.
2) Ref: JEDEC MO-137B/AD
3) Dimensions do not include mold flash, protrusions or gate burrs
.228
.244
5.79
6.19
Pericom Semiconductor Corporation
3545 N. 1st Street, San Jose, CA 95134
1-800-435-2335 • www.pericom.com
DESCRIPTION: 20-Pin, 150-Mil Wide, QSOP
PACKAGE CODE: Q
Packaging Mechanical: 20-Pin TSSOP (L)
20
.169 4.3
.177 4.5
DOCUMENT CONTROL NO.
PD - 1311
REVISION: E
DATE: 03/09/05
1
.252
.260
6.4
6.6
.047
1.20
Max
SEATING
PLANE
.0256
BSC
0.65
.007
.012
0.19
0.30
.002 _0.05
.006 _0.15
Note:
1. Package Outline Exclusive of Mold Flash and Metal Burr
2. Controlling dimentions in millimeters
3. Ref: JEDEC MO-153F/AC
0.45 .018
0.75 .030
.238
.269
6.1
6.7
.004 0.09
.008 0.20
Pericom Semiconductor Corporation
3545 N. 1st Street, San Jose, CA 95134
1-800-435-2336 • www.pericom.com
DESCRIPTION: 20-Pin, 173-Mil Wide, TSSOP
PACKAGE CODE: L
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10-0247
4
www.pericom.com
PS8162i
12/08/10