PE71S6090 Datasheet, PDF (3/6 Pages) Pasternack Enterprises, Inc. – SPDT Electromechanical Relay Switch DC to 3 GHz, SMT, 400 Watts, 24V Control with Failsafe

PE71S6090 CAD Drawing
SPDT Electromechanical Relay Switch DC to 3 GHz,
SMT, 400 Watts, 24V Control with Failsafe
A – Soldering procedure using automatic pick and place
equipment
1-Solder paste:
R596 series are « Lead Free », and Lead Free Sn-Ag3.5-
Cu0.7 solder cream may be used as well as standard Sn63–
Pb35–Ag2. It is recommended using a « no clean - low
residue » solder cream (5% solid residue of flux quantity)
that will permit the elimination of the cleaning operation step
after soldering.
Note: Due to the gold plating of the switch PCB interface, it
is important to use a paste made with silver. This will help in
avoiding formation of intermetallics as part of the solder joint.
RECOMMENDED SOLDERING PROCEDURE
2-Solder paste deposition:
Solder cream may be applied on the board with screen
printing or dispenser technologies. For either method, the
solder paste must be coated to appropriate thickness and
shapes to achieve good solder wetting. Please optically
verify that the edges of the zone are clean and without
contaminates, and that the PCB zoned areas have not
oxydated. The design of the mounting pads and the
stenciling area are given on page 7, for a thickness of the
silk-screen printing of 0.15 mm (0.006 ‘’).
3-Placement of the component:
For small lightweight components such as chip components,
a self-alignment effect can be expected if small placement
errors exist. However, this effect is not as expected for
relays components and they require a accurate positioning
on their soldering pads, typically +/- 0.1mm (+/-0.004’’).
Place the relay onto the PCB with automatic pick and place
equipment. Various types of suction can be used.
We do not recommend using adhesive agents on the
component or on the PCB.
4-Soldering: infra-red process
Please follow the recommended temperature profile for infra-
red reflow or forced air convection:
5-Cleaning procedure:
On miniature relays, high frequency cleaning may cause the
contacts to stick. If cleaning is needed, please avoid
ultrasonic cleaning and use alcohol based cleaning
solutions.
In-line cleaning process, spraying, immersion,
especially under temperature, may cause a risk of
degradation of internal contacts.
6-Quality check:
Verify by visual inspection that the component is centered on
the mounting pads.
Solder joints: verify by visual inspection that the formations
of meniscus on the pads are proper, and have a capillarity
amount upper the third of the height.
B – Soldering procedure by manual operation
1-Solder paste and flux deposition:
Refer to procedure A – 1
Deposite a thin layer of flux on mounting zone.
Allow the flux to evaporate a few seconds before applying
the solder paste, in order to avoid dilution of the paste.
2-Solder paste deposition:
We recommends depositing a small amount of solder paste
on the mounting zone area by syringe.
Be careful, not to apply solder paste outside of the zone
area.
3-Placement of the component:
During manipulation, avoid contaminating gold surfaces by
contact with fingers.
Place the component on the mounting zone by pressing on
the top of the relay lid.
4-Hand soldering:
Iron wattage 30 to 60 W.
Tip temperature 280 to 300°C for max. 5 seconds
To keep good RF characteristics above 3GHz, it is important
to solder RF ports first, and apply pressure on the relay lid
during all the soldering stage, so as to reduce the air gap
between the PC board and the relay.
5-Cleaning procedure:
Refer to procedure A – 5.
6-Quality check:
Verify by visual inspection that component is centered on the
mounting pads.
Solder joints: verify by visual inspection that the formations
of meniscus on the RF pads are proper, and have a
capillarity amount higher than one third of the height.
Higher temperature (>260°C) and longer process
duration would damage permanently the switches
PE71S6090 REV 1.0
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