L-T670WDT-NW5-P Datasheet, PDF (15/17 Pages) PARA LIGHT ELECTRONICS CO., LTD. – SURFACE MOUNT DEVICE LED

SURFACE MOUNT DEVICE LED
Part No. : LT670WDT-NW5-P
4. Lead-Free Soldering
For Reflow Soldering :
1、Pre-Heat Temp: 150-180℃,120sec.Max.
2、Soldering Temp: Temperature Of Soldering Pot Over 240℃,40sec.Max.
3、Peak Temperature: 260℃，10sec.
4、Reflow Repetition: 2 Times Max.
5、Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu
For Soldering Iron (Not Recommended) :
1、Iron Tip Temp: 350℃ Max.
2、Soldering Iron: 30w Max.
3、Soldering Time: 3 Sec. Max. One Time.
5. Drive Method
Circuit model A
Circuit model B
Release by
PARA LIGHT DCC
REV: A / 0
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
6. Reliability
1、Criteria For Judging The Damage
Item
Symbol
Forward Voltage
VF
Reverse Current
IR
Luminous Intensity
IV
*) U.S.L.: Upper Standard Level
**) L.S.L: Lower Standard Level
Test Conditions
IF=20mA
VR=5V
IF=20mA
Criteria for Judgement
MIN.
-
-
L.S.L**)×0.7
Max.
U.S.L.*)×1.1
U.S.L.*)×2.0
-
DRAWING NO. : DS-7A-11-0017
PARA-FOR-068
DATE : 2011-11-23 PAGE 15 of 17