L-T670HECT Datasheet, PDF (13/15 Pages) PARA LIGHT ELECTRONICS CO., LTD. – SURFACE MOUNT DEVICE LED

SURFACE MOUNT DEVICE LED
Part No. : L-T670HECT
4. Lead-Free Soldering
For Reflow Soldering :
1ΕPre-Heat Temp: 150-180к,120sec.Max.
2ΕSoldering Temp: Temperature Of Soldering Pot Over 240к,40sec.Max.
3ΕPeak Temperature: 260кΔ10sec.
4ΕReflow Repetition: 2 Times Max.
5ΕSuggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu
For Soldering Iron (Not Recommended) :
1ΕIron Tip Temp: 350к Max.
2ΕSoldering Iron: 30w Max.
3ΕSoldering Time: 3 Sec. Max. One Time.
5. Drive Method
Circuit model A
Circuit model B
REV: A / 0
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
6. Reliability
ǃ1 Criteria For Judging The Damage
Item
Symbol
Forward Voltage
VF
Reverse Current
IR
Luminous Intensity
IV
 U.S.L.: Upper Standard Level
**) L.S.L: Lower Standard Level
Test Conditions
IF=20mA
VR=5V
IF=20mA
Criteria for Judgement
MIN.
Max.
-
h U.S.L.*) 1.1
-
h U.S.L.*) 2.0
h L.S.L**) 0.7
-
DRAWING NO. : DS-7A-10-0005
PARA-FOR-068
DATE : 2009-11-18 PAGE 13 of 15