L-S115KRKGCT-5A Datasheet, PDF (13/15 Pages) PARA LIGHT ELECTRONICS CO., LTD. – SURFACE MOUNT DEVICE LED

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PARA LIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-S115KRKGCT-5A
REV: A / 0
3.Soldering(Standard Process) :
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
Soldering Iron : (Not recommended)
Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60s Max, Solder wave 260°C Max, Soldering time 5 sec. Max.
preformed consecutively cooling process is required between 1st and 2nd soldering processes.
4. Lead-Free Soldering
For Reflow Soldering :
1 Pre-Heat Temp : 150-180 ,120sec.Max.
2 Soldering Temp : Temperature Of Soldering Pot Over 230 ,40sec.Max.
3 Peak Temperature : 260 5sec.
4 Reflow Repetition : 2 Times Max.
5 Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
For Soldering Iron (Not Recommended) :
1 Iron Tip Temp : 350 Max.
2 Soldering Iron : 30w Max.
3 Soldering Time : 3 Sec. Max. One Time.
For Dip Soldering :
1 Pre-Heat Temp : 150 Max. 120 Sec. Max.
2 Bath Temp : 265 Max.
3 Dip Time : 5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
DRAWING NO. : DS-78-08-0001
PARA-FOR-068
DATE : 2008-01-14 PAGE 13 of 15