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L-C170QRCT Datasheet, PDF (12/14 Pages) PARA LIGHT ELECTRONICS CO., LTD. – SURFACE MOUNT DEVICE LED | |||
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Release by
PARA LIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-C170QRCT
4. Lead-Free Soldering
For Reflow Soldering :
1ãPre-Heat Temp:150-180â,120sec.Max.
2ãSoldering Temp:Temperature Of Soldering Pot Over 230â,40sec.Max.
3ãPeak Temperature:260âï¼5sec.
4ãReflow Repetition:2 Times Max.
5ãSuggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
REV:A / 2
For Soldering Iron (Not Recommended) :
1ãIron Tip Temp:350â Max.
2ãSoldering Iron:30w Max.
3ãSoldering Time:3 Sec. Max. One Time.
For Dip Soldering :
1ãPre-Heat Temp:150â Max. 120 Sec. Max.
2ãBath Temp:265â Max.
3ãDip Time:5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
DRAWING NO. : DS-72-06-0010
PARA-FOR-068
DATE : 2007-05-18 PAGE 12 of 14
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