L-C170LBCT Datasheet, PDF (12/14 Pages) PARA LIGHT ELECTRONICS CO., LTD. – SURFACE MOUNT DEVICE LED

SURFACE MOUNT DEVICE LED
Release
Release by
PARA LIGHT DCC
by
PARA LIGHT DCC
Part No. : L-C170LBCT
REV:C/5
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max.
preformed consecutively cooling process is required between 1^st and 2^nd soldering processes.
4. Lead-Free Soldering
For Reflow Soldering :
1 Pre-Heat Temp:150-180 ,120sec.Max.
2 Soldering Temp:Temperature Of Soldering Pot Over 230 ,40sec.Max.
3 Peak Temperature:260 5sec.
4 Reflow Repetition:2 Times Max.
5 Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
For Soldering Iron (Not Recommended) :
1 Iron Tip Temp:350 Max.
2 Soldering Iron:30w Max.
3 Soldering Time:3 Sec. Max. One Time.
For Dip Soldering :
1 Pre-Heat Temp:150 Max. 120 Sec. Max.
2 Bath Temp:265 Max.
3 Dip Time:5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
DRAWING NO. : DS-72-03-0009
PARA-FOR-068
DATE : 2011-08-15 PAGE 12 of 14