L-C155TBJSCT-5A Datasheet, PDF (12/13 Pages) PARA LIGHT ELECTRONICS CO., LTD. – SURFACE MOUNT DEVICE LED

Release by
PARA LIGHT DCC
SURFACE MOUNT DEVICE LED
Part No.: L-C155TBJSCT-5A
REV:A/0
Wave soldering:
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max. preformed
consecutively cooling process is required between 1^st and 2^nd soldering processes.
4. Lead-Free Soldering
For Reflow Soldering:
1、Pre-Heat Temp:150-180℃,120sec.Max.
2、Soldering Temp: Temperature Of Soldering Pot Over 230℃,40sec.Max.
3、Peak Temperature:260℃，5sec.
4、Reflow Repetition:2 Times Max.
5、Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
For Soldering Iron (Not Recommended):
1、Iron Tip Temp:350℃ Max.
2、Soldering Iron:30w Max.
3、Soldering Time:3 Sec. Max. One Time.
For Dip Soldering:
1、Pre-Heat Temp:150℃ Max. 120 Sec. Max.
2、Bath Temp:265℃ Max.
3、Dip Time:5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
DRAWING NO.: DS-31-09-XXXX
PARA-FOR-068
DATE: 2009-06-30
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