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STZ23C5V6TS Datasheet, PDF (1/6 Pages) Pan Jit International Inc. – SURFACE MOUNT ZENER DIODES | |||
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STZ23C5V6TS
SURFACE MOUNT ZENER DIODES
FEATURES
⢠Planar die construction
⢠150mW Power dissipation
⢠Ideally suited for automated assembly processes
⢠Ultra Thin Profile Package for Space Constrained Utilization
⢠Package suitable for Automated Handling
⢠Exceed ESD standard based on IEC-61000-4-2 Contact : 8kV, Air : 15kV
⢠Lead free in comply with EU RoHS 2011/65/EU directives.
⢠Green molding compound as per IEC61249 Std. . (Halogen Free)
MECHANICAL DATA
⢠Case: SOD-523, Molded Plastic
⢠Terminals: Solderable per MIL-STD-750, Method 2026
⢠Polarity: See circuit schematic below
⢠Approx. Weight: 0.0001 ounce, 0.0014 gram
⢠Mounting Position: Any
⢠Marking : AD
0.034(0.85)
0.029(0.75)
0.050(1.25)
0.045(1.15)
0.014(0.35)
0.009(0.25)
0.026(0.65)
0.021(0.55)
0.067(1.70)
0.059(1.50)
0.006(0.15)
0.002(0.05)
0.20 MIN.
1
C a th o d e
2
A node
ABSOLUTE MAXIMUM RATINGS (TA=25oC unless otherwise noted)
PARAMETER
Maximum Power Dissipation
Typical Thermal Resistance, Junction to Ambient (Note1)
Operating Junction Temperature and Storage Temperature Range
SYMBOL
PD
RïJA
TJ,TSTG
ELECTRICAL CHARACTERISTICS (TA=25oC unless otherwise noted)
PARAMETER
SYMBOL
CONDITION
Zener Voltage
VZ
I Z=5mA
Maximum DC Reverse Current
IR
VR=2.5V
Dynamic Impedance
ZZT
I Z=5mA
Rising Operation Resistance
ZZK
I Z=0.5mA
Typical Capacitance Junction
CJ
f=1MHZ
VR=5V
NOTES:
1. Mounted on an FR4 PCB, single-sided copper, mini pad.
January 03,2013-REV.00
VALUE
150
750
-55 to +150
UNITS
mW
oC/W
oC
VALUE
Nom.
Min.
Max.
5.6
5.31
5.92
1.0
15
60
17
UNIT
V
V
ïA
ï
ï
pF
PAGE . 1
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