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SK32_07 Datasheet, PDF (1/3 Pages) Semikron International – Schottky barrier rectifiers diodes
SK32 ~ S310
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
VOLTAGE 20 to 100 Volts CURRENT 3.0 Amperes SMC/DO-214AB
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O
• For surface mounted applications
• Low profile package
• Built-in strain relief
• Metal to silicon rectifier. majority carrier conduction
• Low power loss,high efficiency
• High surge capacity
• For use in low voltage high frequency inverters, free wheeling,
and polarity protection applications
• In compliance with EU RoHS 2002/95/EC directives
.280(7.11)
.260(6.60)
Unit: inch (mm)
.012(.305)
.006(.152)
MECHANICAL DATA
• Case: JEDEC DO-214AB molded plastic
• Terminals:Solder plated, solderable per MIL-STD-750, Method 2026
• Polarity: Color band denotes positive end (cathode)
• Standard packaging: 16mm tape (EIA-481)
• Weight: 0.007 ounce, 0.21 gram
.050(1.27)
.030(0.76)
.008(.203)
.002(.051)
.320(8.13)
.305(7.75)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Resistive or inductive load.
PARAMETER
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Current .375"(9.5mm)
lead length at TL=75OC
Peak Forward Surge Current : 8.3ms single half sine-
wave superimposed on rated load(JEDEC method)
Maximum Forward Voltage at 3.0A ( Note 1)
Maximum DC Reverse Current TJ=25OC
at Rated DC Blocking Voltage TJ=100OC
Maximum Thermal Resistance ( Note 2)
Op e ra ti ng J unc ti o n Te mp e ra ture Ra ng e
S to ra g e Te mp e ra ture Ra ng e
S YMB OL S K 3 2 S K 3 3 S K 3 4 S K 3 5 S K 3 6 S K 3 8 S K 3 9 S 3 1 0 UNITS
V RRM
V RMS
VDC
IF ( AV )
20
30
40
50
60 80 90 100
V
14
21
28
35
42
56
64
70
V
20
30
40
50
60 80 90 100
V
3.0
A
IF S M
100
A
VF
IR
R θJ L
R θJ A
TJ
TSTG
0.50
0.75
0.5
20
20
75
-55 to +125
-55 to +150
0.85
-55 to +150
V
mA
OC / W
OC
OC
NOTES:
1. Pulse Test with PW =300µsec, 1% Duty Cycle.
2. Mounted on P.C. Board with 8.0mm2 (.013mm thick) copper pad areas.
STAD-JAN.23.2007
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