SDI260 Datasheet, PDF (1/4 Pages) Pan Jit International Inc. – MICRO SURFACE MOUNT SCHOTTKY BRIDGE

SDI260 / SDI2100
MICRO SURFACE MOUNT SCHOTTKY BRIDGE
VOLTAGE 60 / 100 Volts ^{CURRENT 2 Amperes}
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
Flame Retardant Epoxy Molding Compound.
• Exceeds environmental standards of MIL-S-19500/228
• Low power loss, high efficiency.
• Low forward voltage, high current capability
• High surge capacity.
• Super fast recovery times, high voltage.
• Epitaxial chip construction.
• Ultra thin profile package for space constrained utilization
• Lead free in comply with EU RoHS 2011/65/EU directives.
• Green molding compound as per IEC61249 Std. . (Halogen Free)
MECHANICAL DATA
• Case: Reliable construction utilizing molded plastic technique results in product
• Terminals: Lead solderable per MIL-STD-750, Method 2026
• Polarity: Polarity symbols molded or marking on body
• Weight: 0.011 ounce, 0.4 gram
0.335(8.51)
0.316(8.05)
0.045(1.14)
0.035(0.89)
0.022(0.56)
0.018(0.46)
0.075(1.90)
0.055(1.39)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.Single phase, half wave, 60Hz, Resistive or inductive load.
For capacitive load, derate current by 20%
PARAMETER
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
Peak Forward Surge Current : 8.3ms single half sine-wave
superimposed on rated load (JEDEC method)
Maximum Forward Voltage at 2A
Maximum D C Reverse C urrent at Rated D C Blocking Voltage
Typ i ca l J uncti o n C a p a c i ta nce (V _R=4 V,f=1 MHz)
Typ i ca l The rma l Re si sta nce p e r d i o d e
Op e r a ti ng a nd S to r a g e Te mp e r a ture Ra ng e
S to r a g e Te mp e r a ture Ra ng e
S YMB OL
per diode
V _RRM
V
RMS
V_DC
I_{F (AV )}
I_{F S M}
per diode
V_F
per diode
(Note 1)
(Note 2)
I_R
C_J
R_JA
R_JL
T_J
T _{S TG}
S D I2 6 0
60
S D I2100 UNITS
100
V
42
70
V
60
100
V
2
A
50
A
0.68
0.84
V
50
4
uA
130
125
85
85
31
20
-55 to + 150
pF
O_{C / W}
O_C
-55 to + 150
O_C
NOTES:
1. Mounted on an FR4 PCB, single-sided copper, mini pad.
2. Mounted on an FR4 PCB, single-sided copper, with 48cm² copper pad area.
January 23,2013-REV.01
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