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SD620CS_04 Datasheet, PDF (1/2 Pages) Pan Jit International Inc. – SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS
DATA SHEET
SD620CS~SD6100CS
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS
VOLTAGE 20 to 100 Volts CURRENT 6.0 Amperes
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O
• For surface mounted applications
• Low profile package
• Built-in strain relief
• Low power loss, High efficiency
• High surge capacity
• For use in low voltage high frequency inverters, free wheeling, and
polarity protection applications
• High temperature soldering guaranteed:260 oC/10 seconds at terminals
• Both normal and Pb free product are available :
Normal : 80~95% Sn, 5~20% Pb
Pb free: 98.5% Sn above
MECHANICAL DATA
Case: D PAK/TO-252 molded plastic
Terminals: Solder plated, solderable per MIL-STD-750,Method 2026
Polarity: As marking
Standard packaging: 16mm tape (EIA-481)
Weight: 0.015 ounces, 0.4grams.
TO-252 / DPAK
.264(6.7)
.248(6.3)
.216(5.5)
.200(5.1)
.106(2.7)
.090(2.3)
.09 .09
(2.3) (2.3)
.032(0.8)
.012(0.3)
Unit : inch (mm)
.098(2.5)
.082(2.1)
.024(0.6)
.016(0.4)
.02(0.5)
.071(1.8)
.051(1.3)
C
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PARAMETER
SYMBOL SD620CS SD630CS SD640CS SD650CS SD660CS SD680CS SD6100CS UNITS
Maximum Recurrent Peak Reverse Voltage
V RRM
20
30
40
50
60
80
100
V
Maximum RMS Voltage
V RMS
14
21
28
35
42
56
70
V
Maximum DC Blocking Voltage
VDC
20
30
40
Maximum Average Forward Current .375"(9.5mm)
lead length at Tc =75OC
IAV
Peak Forward Surge Current :8.3ms single half sine-wave
superimposed on rated load(JEDEC method)
IF S M
Maximum Forward Voltage at 3.0A per leg
VF
0.55
Maximum DC Reverse Current TJ=25OC
at Rated DC Blocking Voltage TJ=100OC
IR
Typi cal Thermal Resi stance
RθJC
50
60
6.0
75
0.70
0.2
20
5
80
100
V
A
A
0.85
V
mA
OC / W
Operati ng Juncti on Temperature Rang
TJ
-50 to +125
OC
S torage Temperature Rang
TJ,TSTG
-50 to +150
OC
Note: Both Bonding and Chip structure are available.
STAD-FEB.27.2004
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