SB3020ST Datasheet, PDF (1/2 Pages) Pan Jit International Inc. – SCHOTTKY BARRIER RECTIFIERS

SB3020ST SERIES
SCHOTTKY BARRIER RECTIFIERS
VOLTAGE 20 to 60 Volts CURRENT 30 Amperes
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
Flame Retardant Epoxy Molding Compound.
• Exceeds environmental standards of
MIL-S-19500/228
• Low power loss, high efficiency.
• Low forward voltage, high current capability
• High surge capacity.
• For use in low voltage,high frequency inverters
free wheeling , and polarlity protection applications.
• In compliance with EU RoHS 2002/95/EC directives
MECHANICAL DATA
• Case: TO-247S/TO-3PS Molded plastic
• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
• Polarity: As marked.
• Standard packaging: Any
• Weight: 0.1932 ounces, 5.4803 grams.
0.615(15.60)MAX.
0.520(13.20)
0.504(12.80)
0.402(10.20)
0.385(9.80)
0.118(3.0)
MIN.
0.599(15.20)
0.582(14.80)
0.071(1.80)
0.055(1.40)
0.095(2.40)
0.078(2.00)
0.050(1.25)
0.037(0.95)
0.223(5.65)
0.206(5.25)
0.223(5.65)
0.206(5.25)
0.185(4.70)
0.169(4.30)
0.103(2.60)
0.090(2.30)
0.025(0.62)
0.014(0.38)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PA RA M E TE R
S YMB OL SB3020ST SB3030ST SB3040ST SB3045ST SB3050ST SB3060ST UNITS
Maximum Recurrent Peak Reverse Voltage
V _RRM
20
30
40
45
50
60
V
Maximum RMS Voltage
V _RMS
14
21
28
31.5
35
42
V
Maximum DC Blocking Voltage
Maximum Average Forward Current at
T c =75^OC
Peak Forward Surge Current : 8.3ms single
half sine-wave superimposed on rated load
(JEDEC method)
Maximum Forward Voltage at 15A per leg
Maximum DC Reverse Current at
Rated DC Blocking Voltage
Typ i c a l The rma l Re s i sta nce
T_J=25 ^OC
T_J=1 00^OC
V_DC
I_{F ( AV )}
I_FSM
V_F
I_R
R_JC
20
30
40
45
30.0
275
0.55
0.2
50
1.5
50
60
V
A
A
0.70
V
mA
O_{C / W}
Op e r a ti ng J unc ti o n Te mp e r a tur e Ra ng e
T_J
-55 to +125
-55 to +150
O_C
S to r a g e Te m p e ra tur e Ra ng e
T _{S TG}
-55 to +150
O_C
NOTE:
Both Bonding and Chip structure are available.
August 30,2010-REV.03
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