SB3020PT_16 Datasheet, PDF (1/4 Pages) Pan Jit International Inc. – SCHOTTKY BARRIER RECTIFIERS

SB3020PT SERIES
SCHOTTKY BARRIER RECTIFIERS
VOLTAGE 20 to 60 Volt CURRENT 30 Ampere
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
Flame Retardant Epoxy Molding Compound.
• Low power loss, high efficiency.
• Low forward voltage, high current capability
• High surge capacity.
• For use in low voltage,high frequency inverters
free wheeling , and polarlity protection applications.
• Lead free in compliance with EU RoHS 2011/65/EU directive
MECHANICAL DATA
• Case: TO-3P Molded plastic
• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
• Polarity: As marked.
• Standard packaging: Any
• Weight: 0.2245 ounces, 6.3673 grams.
0.640(16.25)
0.620(15.75)
0.142(3.60)
0.125(3.20)
0.199(5.05)
0.175(4.45)
0.087(2.20)
0.070(1.80)
0.126(3.20)
0.110(2.80)
0.050(1.25)
0.045(1.15)
0.225(5.70)
0.204(5.20)
0.225(5.70)
0.204(5.20)
0.095(2.40)
0.030(0.75)
0.017(0.45)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PARAMETER
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
S YM B O L S B 3 0 2 0 P T S B 3 0 3 0 P T S B 3 0 4 0 P T S B 3 0 4 5 P T S B 3 0 5 0 P T S B 3 0 6 0 P T U N ITS
V _RRM
20
30
40
45
50
60
V
V
14
21
28
31.5
35
42
V
RMS
Maximum DC Blocking Voltage
V _DC
20
30
40
45
50
60
V
Ma xi mum A ve ra g e F o rwa rd C urre nt a t Tc =7 5^OC
Peak Forward Surge Current :8.3ms single
half sine-wave superimposed on rated load
Maximum Forward Voltage at 15A per leg
Maximum DC Reverse Current at Rated
DC Blocking Voltage
Typ i ca l The rma l Re si sta nce
T_J=2 5 ^OC
T_J= 1 0 0 ^OC
Op e r a ti ng J unc ti o n Te m p e ra t ure Ra ng e
S t o ra g e Te m p e ra t ur e Ra ng e
I_{F ( AV )}
I_{F S M}
V_F
I
R
R_θJC
T_J
T
STG
30
275
0.55
0.7
0.2
50
1.5
-55 to +125
-55 to +150
-55 to +150
A
A
V
mA
O_{C / W}
O_C
O_C
NOTE:
Both Bonding and Chip structure are available.
May 12,2016-REV.03
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