SB2020CT_05 Datasheet, PDF (1/2 Pages) Pan Jit International Inc. – SCHOTTKY BARRIER RECTIFIERS

DATA SHEET
SB2020CT~SB20200CT
SCHOTTKY BARRIER RECTIFIERS
VOLTAGE 20 to 200 Volts CURRENT 20 Amperes
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
Flame Retardant Epoxy Molding Compound.
• Exceeds environmental standards of
MIL-S-19500/228
• Low power loss, high efficiency.
• Low forwrd voltge, high current capability
• High surge capacity.
• For use in low voltage,high frequency inverters
free wheeling , and polarlity protection applications.
• Pb free product are available : 99% Sn above can meet Rohs
environment substance directive request
MECHANCAL DATA
Case: TO-220AB Molded plastic
Terminals: Solder plated, solderable per MIL-STD-202G, Method 208
Polarity: As marked.
Standard packaging: Any
Weight: 0.08 ounces, 2.24grams.
TO-220AB
.419(10.66)
.387(9.85)
.139(3.55)
MIN
.038(0.96)
.019(0.50)
.1(2.54)
.1(2.54)
AC
Positive CT
AC
Unit : inch (mm)
.196(5.00)
.163(4.16)
.054(1.39)
.045(1.15)
.025(0.65)MAX
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PARAMETER
SYMBOL SB2020CT SB2030CT SB2040CT SB2050CT SB2060CT SB2080CT SB20100CT SB20150CT SB20200CT UNITS
Maximum Recurrent Peak Reverse Voltage
V RRM
20
30
40
50
60
80
100
150
200
V
Maximum RMS Voltage
V RMS
14
21
28
35
42
56
70
105
140
V
Maximum DC Blocking Voltage
VDC
20
30
40
Maximum Average Forward Current .375"(9.5mm)
lead length at Tc =90 ^OC
IAV
Peak Forward Surge Current :8.3ms single half sine-
wave superimposed on rated load(JEDEC method)
IFSM
Maximum Forward Voltage at 10.0A, per leg
VF
0.55
Maximum DC Reverse Current TA=25 ^OC
at Rated DC Blocking Voltage TA=100^OC
IR
Typical Thermal Resistance
RθJC
50
60
80
100
150
200
V
20.0
A
200
A
0.75
0.85
0.5
100
2
0.92
1
V
mA
O_{C / W}
Operati ng Juncti on Temperature Range
TJ
-50 TO +125
O_C
S torage Temperature Range
TSTG
-50 TO +150
O_C
Note.
Both Bonding and Chip structure are available.
REV.1-APR.6.2005
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