PJZ4V3XBWS Datasheet, PDF (1/5 Pages) Pan Jit International Inc. – Planar Die construction

PJZ4V3XBWS
SURFACE MOUNT ZENER DIODES
FEATURES
• Planar Die construction
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive
• Green molding compound as per IEC61249 Std. . (Halogen Free)
MECHANICAL DATA
• Case: SOD-323, Molded Plastic
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 0.00014 ounces, 0.0041 grams
0.054(1.35)
0.045(1.15)
0.078(1.95)
0.068(1.75)
0.014(0.35)
0.009(0.25)
0.036(0.90)
0.027(0.70)
0.107(2.7)
0.090(2.3)
0.006(0.15)
0.002(0.05)
0.012(0.30)MIN.
1
Cathode
2
Anode
ABSOLUTE MAXIMUM RATINGS (TA=25^oC unless otherwise noted)
PARAMETER
Maximum Power Dissipation (Notes 2)
Typical Thermal Resistance, Junction to Ambient (Notes 1)
Operating Junction Temperature and Storage Temperature Range
SYMBOL
PD
RJA
TJ,TSTG
VALUE
250
650
-55 to +150
NOTES : 1. Mounted on a FR4 PCB, single-sided copper, mini pad.
2.Mounted on a FR4 PCB, single-sided copper, wtih 10cm * 10cm copper pad area.
UNITS
mW
o_C/W
o_C
ELECTRICAL CHARACTERISTICS (TA=25^oC unless otherwise noted)
Nom. V
4.3
Nominal Zener Voltage
VZ @ I ZT
Min. V
4.08
Max. V
4.51
Max. Zener Impedance
ZZT @ I ZT

A
900
500
Max Reverse
Leakage Current
I R @ VR
A
V
5
1
Marking
Code
YJ
April 18,2014-REV.00
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