MBR3040PT Datasheet, PDF (1/2 Pages) Pan Jit International Inc. – SCHOTTKY BARRIER RECTIFIERS

MBR3040PT SERIES
SCHOTTKY BARRIER RECTIFIERS
VOLTAGE 40 to 200 Volts CURRENT 30 Amperes
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
Flame Retardant Epoxy Molding Compound.
• Metal silicon junction, majority carrier conduction
• Low power loss, high efficiency.
• High current capability
• Guardring for overvoltage protection
• For use in low voltage,high frequency inverters
free wheeling , and polarlity protection applications.
• In compliance with EU RoHS 2002/95/EC directives
MECHANICAL DATA
• Case: TO-247AD/TO-3P molded plastic
• Terminals: solder plated, solderable per MIL-STD-750, Method 2026
• Polarity: As marked.
• Mounting Position: Any
• Weight: 0.2245 ounces, 6.3673 grams.
0.640(16.25)
0.620(15.75)
0.142(3.60)
0.125(3.20)
0.087(2.20)
0.070(1.80)
0.126(3.20)
0.110(2.80)
0.050(1.25)
0.045(1.15)
0.225(5.70)
0.204(5.20)
0.225(5.70)
0.204(5.20)
0.199(5.05)
0.175(4.45)
0.095(2.40)
0.030(0.75)
0.017(0.45)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PARAMETER
S YMB OL MBR3040PT MBR3045PT MBR3050PT MBR3060PT MBR3080PT MBR3090PT MBR30100PT MBR30150PT MBR30200PT UNITS
Maximum Recurrent Peak Reverse Voltage
V _RRM
40
45
50
60
80
90
100
150
200
V
Maximum RMS Voltage
V _RMS
28
31.5
35
42
56
63
70
105
140
V
Maximum DC Blocking Voltage
V _DC
40
45
50
60
80
90
100
150
200
V
Maximum Average Forward Current
I_F(AV)
Peak Forward Surge Current : 8.3ms single
half sine-wave superimposed on rated load
I_FSM
(JEDEC method)
Maximum Forward Voltage at 15A per leg
V_F
0.7
Maximum DC Reverse Current at T_J=25 ^OC
Rated DC Blocking Voltage
T_J= 1 2 5 ^OC
I_R
Typi cal Thermal Resi sta nce
R_JC
Operati ng Juncti on and S torage Temperature
Range
T_J,T_STG
-50 to + 150
30
275
0.75
0.8
0.1
20
1.4
-65 to +175
0.9
0.05
20
A
A
V
mA
O_{C / W}
O_C
Note :
Both Bonding and Chip structure are available.
August 30,2010-REV.02
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