MBR3040CT Datasheet, PDF (1/2 Pages) Pan Jit International Inc. – SCHOTTKY BARRIER RECTIFIERS

MBR3040CT SERIES
SCHOTTKY BARRIER RECTIFIERS
VOLTAGE 40 to 200 Volts CURRENT 30 Amperes
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
Flame Retardant Epoxy Molding Compound.
• Metal silicon junction, majority carrier conduction
• Low power loss, high efficiency.
• High current capability
• Guardring for overvoltage protection
• For use in low voltage,high frequency inverters
free wheeling , and polarlity protection applications.
• In compliance with EU RoHS 2002/95/EC directives
MECHANICAL DATA
• Case: TO-220AB molded plastic
• Terminals: solder plated, solderable per MIL-STD-750, Method 2026
• Polarity: As marked.
• Mounting Position: Any
• Weight: 0.0655 ounces, 1.859 grams.
0.419(10.66)
0.387(9.85)
0.139(3.55)
MIN.
0.058(1.47)
0.042(1.07)
0.038(0.96)
0.019(0.50)
0.100(2.54)
0.100(2.54)
0.196(5.00)
0.163(4.16)
0.054(1.39)
0.045(1.15)
0.115(2.92)
0.080(2.03)
0.025(0.65)MAX.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PA RA ME TE R
S YM B OL MB R3040CT MB R3045C T MB R3050CT MB R3060CT MBR3080C T MB R3090C T MB R30100C T MBR30150C T MB R30200C T UNITS
Maximum Recurrent Peak Reverse Voltage
V _RRM
40
45
50
60
80
90
100
150
200
V
Maximum RMS Voltage
V _RMS
28
31.5
35
42
56
63
70
105
140
V
Maximum DC Blocking Voltage
V_DC
40
45
50
60
80
90
100
150
200
V
Maximum Average Forward Current
I_F(AV)
Peak Forward Surge Current：8.3 ms single
half sine-wave superimposed on rated load
I_FSM
(JEDEC method)
Maximum Forward Voltage at 15A per leg
V
0.7
F
Maximum DC Reverse Current
at Rated DC Blocking Voltage
T =25 OC
J
T =125^OC
I_R
J
Typ i cal Therma l Resi sta nce
R_JC
Op erati ng Juncti o n a nd S to ra ge Te mp e ra ture
Range
T_J,T_STG
-55 to + 150
30
275
0.75
0.8
0.1
20
1.4
-65 to + 175
A
A
0.9
V
mA
O_{C / W}
O_C
Note :
Both Bonding and Chip structure are available.
August 30,2010-REV.03
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