BZX55C2V4 Datasheet, PDF (1/3 Pages) Dc Components – TECHNICAL SPECIFICATIONS OF GLASS SILICON ZENER DIODES

BZX55C2V4~BZX55C100
AXIAL LEAD ZENER DIODES
VOLTAGE 2.4 to 100 Volts POWER
500 mWatts
FEATURES
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• In compliance with EU RoHS 2002/95/EC directives
MECHANICAL DATA
• Case: Molded glass DO-35
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight: 0.13 grams
• Mounting Position: Any
• Ordering information: Suffix :” -35” to order DO-35 Package
• Packing information
B - 2K per Bulk box
T/R - 10K per 13" plastic Reel
T/B - 5K per horiz. tape & Ammo box
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TJ =25°C unless otherwise noted)
Parameter
Symbol
Power Dissipation at Tamb = 25 ^OC
P_TOT
Junction Temperature
T_J
Storage Temperature Range
T_s
Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.
Value
500
175
-65 to +175
Units
mW
O_C
O_C
Parameter
Symbol
Min.
Typ.
Thermal Resistance Junction to Ambient Air
R_θJA
--
--
Forward Voltage at I = 100mA
F
V_F
--
--
Valid provided that leads at a distance of 10 mm from case are kept at ambient temperature.
Max.
0.3
1
Units
K/mW
V
STAD-FEB.10.2009
1
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