B1S Datasheet, PDF (1/2 Pages) Pan Jit International Inc. – MINI SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER(VOLTAGE - 100 to 1000 Volts CURRENT - 0.5 Amperes)

DATA SHEET
B1S~B10S
MINI SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
VOLTAGE - 100 to 1000 Volts CURRENT - 0.5 Amperes
FEATURES
• Plastic material used carries Underwriters
• Laboratory recognition 94V-O
• Low leakage
• Surge overload rating-- 30 amperes peak
• Ideal for printed circuit board
• Exceeds environmental standards of MIL-S-19500
MDI
.275 (7) MAX
.165 (4.2)
.150 (3.8)
Unit: inch ( mm )
.106 (2.7)
.090 (2.3)
MECHANICAL DATA
Case: Reliable low cost construction utilizing molded plastic technique results in
inexpensive product
Terminals: Lead solderable per MIL-STD-202, Method 208.
Polarity: Polarity symbols molded or marking on body.
Mounting Position: Any.
Weight: 0.008 ounce, 0.22 gram.
.008 (.20)
.067 (1.7)
.057 (1.3)
C .02(5)
.051 (1.3)
.035 (0.9)
.043 (1.1)
.027 (0.7)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, Resistive or inductive load.
For capacitive load, derate current by 20%
Maximum Recurrent Peak Reverse Voltage
B1S
B2S
100 200
B4S
B6S
B8S
B10S
UNIT
400
600 800 1000
V
Maximum RMS Bridge input Voltage
70
140
280
420 560
700
V
Maximum DC Blocking Voltage
100 200
400
600 800 1000
V
Maximum Average Forward on glass-epoxy P.C.B (Note 1)
Current TA=30°C
on aluminum substrate (Note 3)
0.5
A
0.8
Peak Forward Surge Current, 8.3ms singlehalf sine-wave
superimposed on rated load
30.0
A
I²t Rating for fusing ( t < 8.35 ms)
5.0
A²t
Maximum Forward Voltage Drop per Bridge Element at 0.5A
1.00
V
Maximum Reverse Current at Rated T_J= 25°C
DC Blocking Voltage per element T_J=125°C
5.0
µA
mA
Typical Junction capacitance per leg (Note 1) CJ
25.0
pF
Typical Thermal resistance per leg (Note 2) RθJA
Typical Thermal resistance per leg (Note 2) RθJA
Operating Temperature Range T_J
85.0
-55 to 150
°C/W
°C
Storage Temperature Range T_A
-55 to 150
°C
NOTES:
1. Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
2. Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.05 X 0.05"(13 x 13mm) copper pads.
3. On alum: substrate P.C.B with an rea of 0.8 x 0.8 x 0.25” ( 20 x 20 x 6.4mm ) mounte on 0.05 x 0.05 “( 13 x 13 mm ) solder pad.
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