EZJZSV270EAK Datasheet, PDF (7/7 Pages) Panasonic Semiconductor – Multilayer Varistors

Multilayer Varistors
n Packaging Specifications
l Standard Packing Quantity
Series Size Code (EIA)
EZJZ
EZJS
0201
0402
0603
2 Array Type
4 Array Type
0603
0805
Thickness
0.3 mm
0.5 mm
0.8 mm
0.6 mm
0.85 mm
0.8 mm
0.8 mm
1.25 mm
Paper taping
Pitch: 2 mm 15,000 pcs./reel
Pitch: 2 mm 10,000 pcs./reel
Pitch: 4 mm 14,000 pcs./reel
Pitch: 4 mm 14,000 pcs./reel
Pitch: 4 mm 14,000 pcs./reel
Pitch: 4 mm 14,000 pcs./reel
Pitch: 4 mm 15,000 pcs./reel
Ñ
Embossed taping
Ñ
Ñ
Ñ
Ñ
Ñ
Ñ
Ñ
Pitch: 4 mm 2,000 pcs./reel
l Paper Taping
P₁: 2mm
t1
Feeding hole
BD0
Chip pocket
A
t2
Chip component
P1 P2 P0 Tape running direction
(Unit: mm)
A ^Symbol
Size Code
B W F E P₁ P₂ P₀ fD t₁ t₂
0201
0402
0.37 0.67
0.5 0.8
±0.03 ±0.03 _{8.0 3.50 1.75 2.00 2.00 4.0 1.5} max. max.
0.62
±0.05
1.12
±0.05
±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.05 +0.1
0
0.7
max.
1.0
max.
P₁: 4mm
t1
Feeding hole
BD0
A
Chip pocket
l Reel
9
-
+
,
9
)
Symbol A
B
C
D
E
W₁
W₂
Dim.
(mm)
f180
0
Ð1
f60.0±0.5 13.0±0.5 21.0±0.8 2.0±0.5
9.0±0.3 11.4±1.00
t2 Chip component
P1 P2 P0 Tape running direction
(Unit: mm)
A ^Symbol
Size Code
B W F E P₁ P₂ P₀ fD t₁ t₂
0603
1.18 1.63
±0.10 ±0.10
0805 1.65 2.4 8.0 3.50 1.75 4.0 2.00 4.0 1.5 1.1 1.4
4 Array Type ±0.2 ±0.2 ±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1 +0.1 max. max.
0
0504 1.0 1.8
2 Array Type ±0.1 ±0.1
l Embossed Taping
t1
Feeding hole Chip pocket
BD0
A
t2
Chip component
P1 P2 P0 Tape running direction
(Unit: mm)
A ^Symbol
Size Code
B W F E P₁ P₂ P₀ fD t₁ t₂
0805
1.55 2.35 8.0 3.50 1.75 4.0 2.00 4.0 1.5 0.6 1.5
±0.20 ±0.20 ±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1 +0.1 max. max.
0
l Leader Part and Taped End
Tape end
160 min.
Vacant position
Leader part
100 min.
Vacant position
400 min.
Unit : mm
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or ues.
Should a safety concern arise regarding this product, please be sure to contact us immediately.