AXK5F10347YG Datasheet, PDF (7/7 Pages) Panasonic Semiconductor – NARROW-PITCH CONNECTORS FOR BOARD-TO-FPC CONNECTION

AXK(5/6)F
NOTES
1. As shown below, excess force
during insertion may result in damage
to the connector or removal of the
solder. Please be careful. Also, to
prevent connector damage please
confirm the correct position before
mating connectors.
• Socket
Recommended PC board pattern
(TOP VIEW)
0.50±0.05
B±0.05
0.50±0.05
0.25±0.05
• Header
Recommended PC board pattern
(TOP VIEW)
0.50±0.05
B±0.05
0.50±0.05
0.25±0.05
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector.
Max. 0.03mm
Max. 0.03mm
3. PC Boards and Recommended
Metal Mask Patterns
Connectors are mounted with high
density, with a pitch interval of 0.4 to 0.5
mm. It is therefore necessary to make
sure that the right levels of solder are
used, in order to reduce solder bridge
and other issues. The figures to the right
are recommended metal mask patterns.
Please use them as a reference.
0.125±0.05
0.30±0.05
Recommended metal mask pattern
Metal mask thickness: Here, 150 µm
(Opening area ratio: 56%)
B±0.01
0.50±0.01
0.50±0.01
0.23±0.01
Recommended metal mask pattern
Metal mask thickness: Here, 120 µm
(Opening area ratio: 69%)
B±0.01
0.50±0.01
0.50±0.01
0.23±0.01
0.125±0.05
0.30±0.05
Recommended metal mask pattern
Metal mask thickness: Here, 150 µm
(Opening area ratio: 58%)
B±0.01
0.50±0.01
0.50±0.01
0.23±0.01
Recommended metal mask pattern
Metal mask thickness: Here, 120 µm
(Opening area ratio: 72%)
B±0.01
0.50±0.01
0.50±0.01
0.23±0.01
* See the dimension table on page 91 for more information on the B dimension of the socket and header.
For other details, please verify with
the product specification sheets.
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