EXCCL4532U1 Datasheet, PDF (6/8 Pages) Panasonic Semiconductor – Chip Bead Cores

■ Packaging Methods (Taping)
● Standard Quantity
Part Number
EXCCL4532U1
EXCCL3225U1
EXCCL3216U1
EXCML45A910H
EXCML32A680U
EXCML20A390U
EXCML16A270U
EXC3B२२२२H
Kind of Taping
Embossed Carrier Taping
● Embossed Carrier Taping
t1
Sprocket hole
Compartment
φD0
A
t2
Chip component
P1
P2 P0
Tape running direction
Chip Bead Cores
Pitch (P₁)
8 mm
4 mm
Quantity
1000 pcs./reel
2000 pcs./reel
3000 pcs./reel
4000 pcs./reel
● Taping Reel
φC
φD
E
φA
T
W
t
Embossed Carrier Dimensions (mm)
Part Number
EXCCL4532U1
EXCCL3225U1
EXCCL3216U1
EXCML45A910H
EXCML32A680U
EXCML20A390U
EXCML16A270U
EXC3B२२२२H
A
B
W
F
E
P₁
P₂
P₀
φD₀
t₁
t₂
3.6±0.2 4.9±0.2 12.0±0.2 5.5±0.1
8.0±0.1
2.4 max.
2.9±0.2 3.6±0.2
8.0±0.2 3.5±0.1
2.0±0.2 3.6±0.2
2.1 max.
1.9±0.2 4.8±0.2 12.0±0.2 5.5±0.1 1.75±0.10 4.0±0.1 2.0±0.1 4.0±0.1 1.5±0.1 0.20±0.05 1.8 max.
1.9±0.2 3.5±0.2
1.5±0.2 2.3±0.2
8.0±0.2 3.5±0.1
1.1±0.2 2.1±0.2
1.6 max.
1.0±0.1 1.8±0.1
0.25±0.05
Standard Reel Dimensions (mm)
Part Number
EXCCL4532U1
EXCCL3225U1
EXCCL3216U1
EXCML45A910H
EXCML32A680U
EXCML20A390U
EXCML16A270U
EXC3B२२२२H
φA
φB
φC
φD
180.0–03.0 60.0±1.0 13.0±0.5 21.0±0.8
E
2.0±0.5
W
13.0^{+–10..05}
09.5^{+–10..05}
13.0^{+–10..05}
T
16.5 max.
13 max.
16.5 max.
t
1.2±0.5
09.5^{+–10..05}
13 max.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006