ERT-J1VA220J Datasheet, PDF (5/14 Pages) Panasonic Semiconductor – The NTC Thermistors

Multilayer NTC Thermistors
■ Specification and Test Method
Item
Specification
Rated Zero-power Within the specified tolerance.
Resistance (R25)
B Value
Within the specified tolerance.
✽ Individual Specification shall specify B25/50 or
B25/85.
Test Method
The value of the d.c. resistance shall be measured at
the rated ambient temperature of 25.0 ±0.1 °C under
the power less than 0.1mW which is negligible self
heat generation.
The Zero-power resistances; R1 and R2, shall be
measured respectively at T1 (°C) and T2 (°C).
The B value is calculated by the following equation.
BT1/T2=
kn (R1)–kn (R2)
1/(T1+273.15)–1/(T2+273.15)
B25/50
B25/85
T1
25.0 ±0.1 °C
25.0 ±0.1 °C
T2
50.0 ±0.1 °C
85.0 ±0.1 °C
Adhesion
The terminal electrode shall be free from peeling Applied force :
or signs of peeling.
Size 0201
:2N
Size 0402, 0603 : 5 N
Duration : 10 s
Size : 0201, 0402
1.0
0.5R
0.3/Size:0201
0.5/Size:0402
Test Sample ^Board
Size : 0603
Test
Sample
Bending Strength There shall be no cracks and other mechanical Bending distance : 1 mm
damage.
Bending speed : 1 mm/s
R25 change : within ±5 %
20
R340
Unit : mm
Resistance to
Soldering Heat
Solderability
45±2
45±2
Unit : mm
There shall be no cracks and other mechanical Soldering bath method
damage.
Solder temperature : 270 ±5 °C
Nallow Tol. type Standard type Dipping period : 3.0 ±0.5 s
R25 change
: within ±2 % within ±3 % Preheat condition :
B Value change : within ±1 % within ±2 %
Step
Temp (°C)
1
80 to 100
2
150 to 200
Period (s)
120 to 180
120 to 180
More than 75 % of the soldered area of both
terminal electrodes shall be covered with fresh
solder.
Soldering bath method
Solder temperature : 230 ±5 °C
Dipping period : 4 ±1 s
Solder : H63A (JIS–Z–3282)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Dec. 2013