ERJ-1GEF1241C Datasheet, PDF (5/6 Pages) Panasonic Semiconductor – Precision Thick Film Chip Resistors

Precision Thick Film Chip Resistors
■ Recommended Land Pattern
In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly.
Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reflow soldering, solder
amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Chip Resistor
Type (inches)
Dimensions (mm)
a
b
c
ERJXG
(01005) 0.15 to 0.2 0.5 to 0.7 0.20 to 0.25
ERJ1G, 1R (0201) 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35
ERJ2R
(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
ERJ3R, 3EK (0603) 0.7 to 0.9 2 to 2.2
0.8 to 1
a
ERJ6R, 6EN (0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4
ERJ8EN (1206) 2 to 2.4
4.4 to 5 1.2 to 1.8
b
ERJ14N
(1210) 2 to 2.4
4.4 to 5 1.8 to 2.8
ERJ12N
(1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5
ERJ12S
(2010) 3.6 to 4
6.2 to 7 1.8 to 2.8
ERJ1TN
(2512) 5 to 5.4
7.6 to 8.6 2.3 to 3.5
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Peak
For soldering (Example : Sn/Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 5 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
Preheating
Heating
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
● Recommended soldering conditions for flow
For soldering
Temperature
Time
Preheating
140 °C to 180 °C
60 s to 120 s
Soldering
245 ± 5 °C
20 s to 30 s
For lead-free soldering
Temperature
Time
150 °C to 180 °C
60 s to 120 s
max. 260 °C
max. 10 s
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER2 of this catalog.
1. Take measures against mechanical stress during and after mounting of Precision Thick Film Chip Resistors (hereafter
called the resistors) so as not to damage their electrodes and protective coatings.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006