EFOS Datasheet, PDF (5/5 Pages) Panasonic Semiconductor – Ceramic Res o na tors, Chip Type (3 Array Type) RoHS compliant

[Type EFOS, EFOSM]
t1 _{Feeding hole φD0 Chip pocket}
Ceramic Resonators, Chip Type
[Type EFOSS]
Feeding hole
3.20
t1
P0
φD0 Chip pocket
P2
2.00
A
P1 P0
t2
P2 Tape running
Chip Componen
direction
Dim.
(mm)
Dim.
(mm)
A
B
W
F
E
P1
3.7±0.2 8.3±0.2 16.0±0.3 7.5±0.1 1.75±0.10 8.0±0.1
P2
P0
2.0±0.1 4.0±0.1
φD0
1.5^+00.1
t1
t2
0.3 3.5 max.
[Type EFOB, EFOBM, EFOJM]
Feeding hole
t1
φD0 _{Chip pocket}
3.60
A
P1
t2
Chip Component
Tape running direction
Dim.
(mm)
Dim.
(mm)
A
B
W
F
E
P1
2.6±0.2 5.1±0.2 12.0±0.3 5.5±0.1 1.75±0.10 4.0±0.1
P2
P0
2.0±0.1 4.0±0.1
φD0
t1
t2
1.5^+00.1 0.6 max. 3.0 max.
A
P1 P0 Type EFOJM
t2
P2
(Example)
Chip Component Tape running direction
Dim.
(mm)
Dim.
(mm)
A
B
W
F
E
P1
1
2 12.0±0.3 5.5±0.1 1.75±0.10 8.0±0.1
P2
P0
2.0±0.1 4.0±0.1
φD0
t1
t2
1.5^+00.1 0.6 max. 3.0 max.
Dim. (mm)
Type EFOB
Type EFOBM
Type EFOJM
A
1
3.7±0.2
3.4±0.2
4.1±0.2
B
2
6.0±0.2
4.6±0.2
4.9±0.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EC170 –
01 Feb. 2009