EZA-NCE221M Datasheet, PDF (4/7 Pages) Panasonic Semiconductor – Chip 3-Terminal Capacitor Array

● Embossed Carrier Taping
Chip 3-Terminal Capacitor Array
● Taping Reel
t1
Compartment
Sprocket hole
fD0
A
t2
fD1
Chip component
P1 P2 P0 Tape running direction
T
fC
Type A
B
W
F
E
P₀
EZASC 2.50^±0.20
Dimensions
(mm) _{EZANC 3.50±0.20}
4.40^±0.20
6.80^±0.20
12.00^±0.30
5.50^±0.20
1.75^±0.20
4.00^±0.10
Type P₁
P₂
fD₀
t₁
t₂
fD₁
EZASC
Dimensions
(mm)
4.00^±0.10
EZANC
2.00^±0.05
1.50−+00.10
0.25^±0.05
1.15^±0.20
1.30^±0.20
1.50−+00.10
fA
W
Dimensions
(mm)
Dimensions
(mm)
fA
180⁺−⁰3.0
fB
60 min.
fC
13.0^±1.0
W
13.0^±1.0
T
15.4^±2.0
■ Recommended Land Pattern Design
Chip 3-Terminal Capacitor Array
(EZANC/EZASC)
f2
c
GND
b
P
Land pattern
Solder resistant
Dimensions
(mm)
Type
a
b
c
d
e
f1
f2
P
EZASC 1.2 to 1.4 0.4 3.1 to 3.3 0.4 to 0.5 0.8 2.9 to 3.3 4.8 to 5.2 0.8
EZANC 2.2 to 2.4 0.4 to 0.6 5.7 to 5.9 0.4 to 0.8 1.8 4.2 to 4.6 7.5 to 7.9 1.27
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006