EXC-28BB221U Datasheet, PDF (4/4 Pages) Panasonic Semiconductor – Chip Bead Array

■ Recommended Land Pattern Design
B
EF EFEF E
Chip Bead Array
Dimension (mm)
A
1.4
B
1.75
C
0.4
D
0.5
E
0.25
F
0.25
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Peak
For soldering (Example : Sn-37Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 10 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
Preheating
Heating
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
Temperature
Time
Preheating
150 °C to 170 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
● Flow soldering
· We do not recommend flow soldering , because flow soldering may cause bridges between the electrodes.
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
Safety Precautions
The following are precautions for individual products. Please also refer to the common precautions for Noise Suppression
Device shown on this catalog.
1. Use rosin-based flux or halogen-free flux.
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
3. Do not apply shock to Chip Bead Array (hereafter called the bead arrays) or pinch them with a hard tool (e.g. pliers
and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress
may damage the bead arrays. Handle with care.
4. Store the bead arrays in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to
60 %, where there are no rapid changes in temperature or humidity.
5. Use the bead arrays within half a year after the date of the outgoing inspection indicated on the packages.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Nov. 2012