EXB14V Datasheet, PDF (4/6 Pages) Panasonic Semiconductor – Chip Resistor Array

● Carrier Tape
Punched Carrier Embossed Carrier
fD0
P1
P2
P0
Chip Resistor Array
Unit (mm)
T
T
A
P1 (2 mm pitch)
fD1 (Only Emboss)
Type
EXB14V
EXB18V
EXB24V
EXB28V
EXBN8V
EXB2HV
EXB34V
EXB38V
EXBV4V
EXBV8V
EXBS8V
A
0.70^{+–00..1005}
1.20^±0.10
1.95^±0.15
2.80^±0.20
B
W
F
0.90
+0.10
–0.05
1.60^±0.10
1.20^±0.10
2.20^±0.10
8.00^±0.20 3.50^±0.05
4.10^±0.15
1.95^±0.20
3.60^±0.20
1.95^±0.20
3.60^±0.20
5.70^±0.20 12.00^±0.30 5.50^±0.20
E
1.75^±0.10
P₁
2.00^±0.10
4.00^±0.10
P₂
2.00^±0.05
P₀
4.00^±0.10
fD₀
T
fD₁
0.52^±0.05
_
1.50
+0.10
–0
0.70^±0.05
0.84^±0.05
1.60 max. 1.50^+–00.10
● Taping Reel
T
fC
fA
W
Type
EXB14V,18V
EXB24V,28V
EXBN8V
EXB2HV
EXB34V,38V
EXBV4V,V8V
EXBS8V
Unit (mm)
fA
fB
fC
W
T
180.0^+–30.0 60 min. 13.0^{±1.0 9.0±1.0 11.4±1.0}
13.0^±1.0 15.4^±2.0
■ Land pattern design
Recommended land pattern design for Network chip is shown below.
fa
b
c
p
Type
14V
Dimensions
a
b
c
0.20 to 0.30 0.25 to 0.30 0.25 to 0.30
18V 0.20 to 0.30 0.15 to 0.20 0.15 to 0.20
24V
0.5 0.35 to 0.40 0.35 to 0.40
V4V,V8V 0.7 to 0.9 0.4 to 0.45 0.4 to 0.45
34V,38V 0.7 to 0.9 0.4 to 0.5 0.4 to 0.5
S8V
1 to 1.2 0.5 to 0.75 0.5 to 0.75
(Not to scale)
Unit (mm)
p
f
0.50 0.80 to 0.90
0.40 0.80 to 0.90
0.65
1.4 to 1.5
0.80
2 to 2.4
0.80
2.2 to 2.6
1.27
3.2 to 3.8
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Sep. 2005