ERJ1GEYJ Datasheet, PDF (4/4 Pages) Panasonic Semiconductor – Thick Film Chip Resistors

Thick Film Chip Resistors
n Recommended Land Pattern
In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount
properly. Generally, the land width should be 0.7 to 0.8 times the width of chip the resistor. In case of reflow soldering,
solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Chip Resistor
a
b
Type
(inches)
ERJ1G(0201)
ERJ2G(0402)
ERJ3G(0603)
ERJ6G(0805)
ERJ8G(1206)
ERJ14(1210)
ERJ12(1812)
ERJ12Z(2010)
ERJ1T(2512)
Dimensions (mm)
a
b
c
0.3 to 0.4 0.8 to 0.9 0.25 to 0.35
0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
0.7 to 0.9 2 to 2.2
0.8 to 1
1 to 1.4 3.2 to 3.8 0.9 to 1.4
2 to 2.4
4.4 to 5 1.2 to 1.8
2 to 2.4
4.4 to 5 1.8 to 2.8
3.3 to 3.7 5.7 to 6.5 2.3 to 3.5
3.6 to 4
6.2 to 7 1.8 to 2.8
5 to 5.4 7.6 to 8.6 2.3 to 3.5
n Recommended Soldering Conditions
Recommendations and precautions are described below.
l Recommended soldering conditions for reflow
áReflow soldering should be a maximum of two times
áPlease contact us for additional information when
used in conditions other than those specified.
áPlease measure the temperature of terminations and study
every type of printed circuit board for solderability, before
actual use.
Peak
Preheating
Heating
For soldering (Example : Sn/Pb)
Temperature
Preheating 140 ¡C to 160 ¡C
Main heating Above 200 ¡C
Peak
235 ± 5 ¡C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Time
Preheating 150 ¡C to 180 ¡C 60 s to 120 s
Main heating Above 230 ¡C 30 s to 40 s
Peak
max. 260 ¡C
max. 10 s
Time
l Recommended soldering conditions for flow
For soldering
Temperature
Time
Preheating
140 ¡C to 160 ¡C
60 s to 120 s
Soldering
245±5 ¡C
20 s to 30 s
For lead-free soldering
Temperature
Time
150 ¡C to 180 ¡C
60 s to 120 s
max. 260 ¡C
max. 10 s
Safety Precautions
1. If transient load (heavy load in a short time) like pulse is to be applied, carry out an evaluation and
confirmation test with the resistors actually mounted on the board.
When a load of more than the rated power is applied under load condition at steady state, it may
impair performance and/or reliability of the resistor.
Never exceed the specified rated power.
2. Chlorine type or other highly-reactive flux is not recommended. Residue could affect performance or reliability of
the resistors.
3. When using a soldering iron, never let the tip of the iron touch the body of the chip resistor. When using a
soldering iron with a tip at a high temperature, solder for as short time as possible (no more than three seconds
and up to 350 ¡C).
4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (pliers or tweezers) as it may
damage the protective coating of the resistor and may affect its performance.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.