EFO-BM2005E5 Datasheet, PDF (4/5 Pages) Panasonic Semiconductor – Ceramic Res o na tors, Chip Type (3 Array Type)

Ceramic Resonators, Chip Type
■ Typical Characteristics ····· Temperature Characteristics
Type EFOS
0.8
0.6
2.0 to 8.39 MHz
8.4 to 13 MHz
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8 _{–20 0 20 40 60 80}
Temperature (°C)
Type EFOB
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8 _{–20 0 20 40 60 80}
Temperature (°C)
Type EFOSM
0.8
0.6
2.0 to 8.39 MHz
0.4
8.4 to 13 MHz
0.2
0.0
–0.2
–0.4
–0.6
–0.8 _{–20 0 20 40 60 80}
Temperature (°C)
Type EFOBM
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8 _{–20 0 20 40 60 80}
Temperature (°C)
Type EFOSS
0.8
0.6
0.4 _{4.0 to 8.39 MHz}
0.2
0.0
–0.2
–0.4
–0.6 ^{8.4 to 13 MHz}
–0.8 _{–20 0 20 40 60 80}
Temperature (°C)
Type EFOJM
0.8
0.6
30 to 50 MHz
0.4
16 to 20 MHz
0.2
0.0
–0.2
–0.4
–0.6
–0.8 _{–20 0 20 40 60 80}
Temperature (°C)
■ Packaging Specifications
● Standard Packing Quantity
Type
Embossed Taping
EFOS, EFOSM 2500 pcs./reel
EFOSS
2000 pcs./reel
EFOB , EFOBM, EFOJM 1000 pcs./reel
Bulk
500 pcs./bag
● Dimensions for Reel in mm (not to scale)
T
E
C
r
D
φ_A
Wt
[Type EFOS, EFOSM]
Dim.
(mm)
φA
330±5
φB
80 min.
C
D
13.0±0.5 21.0±0.8
E
2.0±0.5
Dim.
W
T
t
r
(mm)
16.4^+20.0 22.4 max. 3 max.
1.0
[Type EFOSS, EFOB, EFOBM, EFOJM]
Dim.
(mm)
φA
180±5
φB
60 min.
C
D
13.0±0.5 21.0±0.8
E
2.0±0.5
Dim.
W
T
t
r
(mm)
12.4^+20.0 18.4 max. 3 max.
1.0
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EC169 –
01 Feb. 2009