EXC28BA121U Datasheet, PDF (3/5 Pages) Panasonic Semiconductor – Chip Bead Array

■ Circuit Configuration
8
7
6
5
8
7
6
5
1
2
3
4
1
2
3
4
Chip Bead Array
■ Packaging Methods (Taping)
● Standard Quantity
Part Number
Kind of Taping
EXC28B२२२२U
Embossed Carrier Taping
Pitch (P₁)
4 mm
Quantity
5000 pcs./reel
● Embossed Carrier Taping
● Taping Reel
t1
Sprocket hole _{φ D0}
Compartment
A
t2
Chip component
P1
P2
P0
Tape running direction
φC
φD
E
φA
T
W
t
Embossed Carrier Dimensions (mm)
Part Number
A
B
W
EXC28B२२२२U 1.20±0.15 2.25±0.15 8.0±0.2
F
E
P₁
3.5±0.1 1.75±0.10 4.0±0.1
P₂
2.0±0.1
P₀
4.0±0.1
φD₀
t₁
t₂
1.5±0.1 0.20±0.05 0.9±0.1
Standard Reel Dimensions (mm)
Part Number
EXC28B२२२२U
φA
180–03.0
φB
60.0±1.0
φC
13.0±0.5
φD
21.0±0.8
E
2.0±0.5
W
9.0±0.3
T
11.4±1.5
t
1.2±0.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006