EVPAF Datasheet, PDF (3/3 Pages) Panasonic Semiconductor – 3.0 mm2.6 mm SMD Light Touch Switches

Light Touch Switches/EVPAF
■ Recommended Reflow Soldering Conditions
● Embossed Carrier Taping
MAX.
260
230
180
150
Fan or Normal Temp.
Tape width=12.0 mm
t1
Feeding hole
fD0
Chip pocket
P2 P0
A
(Normal Temp.)
90±30
Soldering Time (s)
40±10
Chip component
t2
P1 Tape running direction
Part No.
EVPAF
Height
0.65/0.70
A
B
W
F
E
P1
3.75±0.2 2.95±0.2 12.0±0.3 5.5±0.1 1.75±0.1 8.0±0.1
P2
2.0±0.1
P0
4.0±0.1
D0 Dia
1.5±0.3
t1
0.3±0.1
Unit: mm
t2
0.8±0.2
● Standard Reel Dimensions in mm (not to scale)
T
E
C
r
D
A
Wt
Item
A
B
C
D
E
Rate (mm) φ380.0±2.0 φ80.0±1.0 φ13.0±0.5 φ21.0±1.0 2.0±0.5
Item
W
T
t
r
Rate (mm) 13.5±1.0 17.5±1.0
—
—
■ Recommended Shape of Test Pole
f1.5 to f2.0
R0.3 mm±0.05 mm
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– ES89 –
00 Sep. 2010