ERX-2FJSR62E Datasheet, PDF (3/7 Pages) Panasonic Semiconductor – Metal (Oxide) Film Re sis tors

■ Taped & Box:
ERG(X)□□S□□□□V
6.0±0.5
Metal (Oxide) Film Resistors Packaging Methods
■ Stand-off Taped & Box:
ERG(X)□□S□U□□□V
H
H
W
crush width 0.8 mm (1 W)
1.1 mm (2 W, 3 W)
W
Part Number
Standard
Quantity
(pcs./box) P
Taping (mm)
50×P W
H
ERG(X)12S□□□□□V 2000 5.0^±0.3 250^±2 52.0^±1.5 —
W1
0d
Box (mm)
a
b
c
— 0.65^±0.05 85
80 255
ERG(X) 1S□□□□□V
ERG(X) 1S□U□□□V
2000
5.0^±0.3 250^±2 52.0^±1.5
—
—
0.65^±0.05
85
12.0^+–20.0 1.2^+–00.15
80 255
ERG(X) 2S□□□□□V
ERG(X) 2S□U□□□V
1000
5.0^±0.3
250^±2
52.0^±1.5
—
15.5^+–20.0
—
1.4^+– 00.15
0.80^±0.05
85
80 255
ERG(X) 3S□□□□□V
1000 10.0^±0.5 500^±2 74.0^{±2.0 —}
— _{0.80±0.05 105}
100
325
ERG(X) 3S□U□□□V
23.0^+–20.0 1.4^+–00.15
Marking
a
b
c
■ Cut & Formed Type
ERG(X)□□S□□□□P
S
fD
L
h
Upper surface
of PW board
h2
0.8 (0.5 W, 1 W)
1.0 (2 W, 3 W, 5 W)
1.2±0.2 (0.5 W, 1 W)
1.4±0.2 (2 W, 3 W, 5 W)
Part Number
ERG(X)12S□□□□P
ERG(X)1S□□□□P
ERG(X)2S□□□□P
ERG(X)3S□□□□P
ERG(X)5S□□□□P
Standard
Quantity
(pcs./box)
1000
L
6.35^{+–00..6355}
Dimensions (mm)
0D
S
2.3^{+–00..53}
10.0^±1.5
h
4.0^±1.5
1000
9.00^{+–11..5000}
2.8^±0.5
12.5^±1.5
4.0^±1.5
1000
12.00^{+–11..5000}
4.0^±1.0
15.0^±1.5
6.0^±1.5
1000
15.00^±1.50 5.5^±1.0
20.0^±2.0
6.5^±1.5
500
24.00^±1.50 8.0^±1.0
30.0^±2.0
7.5^±1.5
h2
4.0^±1.5
4.0^±1.5
4.0^±1.5
4.0^±1.5
4.0^±1.5
ERG(X)□F□□□□PH
S
L
fD
f 0.80±0.05
1.0
1.4±0.2
h
Upper surface
of PW board
h2
Part Number
ERG(X)1F□□□□H
ERG(X)2F□□□□H
ERG(X)3F□□□□H
ERG(X)5F□□□□H
Standard
Quantity
(pcs./box)
1000
L
9.0^{+–11..50}
Dimensions (mm)
0D
S
2.8^±0.5
12.5^±1.5
1000
12.0^{+–11..50}
4.0^±1.0
15.0^±1.5
1000
15.0^±1.5
5.5^±1.0
20.0^±2.0
500
24.0^±1.5
8.0^±1.0
30.0^±2.0
h
8^±2
6^±2
10^±2
10^±2
h2
4.0^±1.5
5.0^±1.5
5.0^±1.5
5.0^±1.5
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Aug. 2012