ERB-SE1R00U Datasheet, PDF (3/5 Pages) Panasonic Semiconductor – Micro Chip Fuse

■ Fusing Characteristics (25 °C typical)
● I–t Characteristics
● Type ERBSE
10
1
0.1
0.01
0.001
✽ Reference Only
0.0001
0.1
1
10
100
Fusing Current (A)
Micro Chip Fuse
● Type ERBSD
10
1
0.1
0.01
0.001
✽ Reference Only
0.0001
0.1
1
10
100
Fusing Current (A)
● I²t–t Characteristics
● Type ERBSE
100
10
1
0.1
0.01
0.001
0.0001
0.0001
0.001
0.01
t (s)
5.0 A
4.0 A
3.0 A
2.5 A
2.0 A
1.5 A
1.25 A
1.0 A
0.75 A
0.5 A
✽ Reference Only
0.1
1
● Type ERBSD
100
10
1
0.1
0.01
0.001
0.0001
0.0001
0.001
3.0 A
2.5 A
2.0 A
1.5 A
1.25 A
1.0 A
0.75 A
0.5 A
0.375 A
0.315 A
0.25 A
0.01
t (s)
✽ Reference Only
0.1
1
■ Packaging Methods
● Standard Quantity
Type
ERBSE
ERBSD
Kind of Taping
Punched Carrier Taping
Pitch (P1)
4 mm
2 mm
Quantity
5000 pcs./ reel
10000 pcs./ reel
● Punched Carrier Taping
Sprocket hole
φD0
A
Compartment
● Taping Reel
T
φC
T Chip component _{P1 P2 P0} Taping running direction
Dimen
sions
(mm)
Type
ERBSE
ERBSD
A
1.00^±0.10
0.65^±0.05
B
1.80^±0.20
1.15^±0.05
W
8.00^±0.20
F
3.50^±0.05
E
1.75^±0.10
Dimen
sions
(mm)
Type
ERBSE
ERBSD
P1
4.00^±0.10
2.00^±0.10
P2
2.00^±0.05
P0
4.00^±0.10
φD0
1.50^+–00.10
T
0.85^±0.07
0.60^±0.07
φA
W
φA
φB
Dimensions
(mm)
180.0−+30.0 60 min.
φC
13.0^±1.0
W
9.0^±1.0
T
11.4^±1.0
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Dec. 2007