EVPAX Datasheet, PDF (2/2 Pages) Panasonic Semiconductor – Light Touch Switches

Light Touch Switches/EVPAX
˙ Dimensions in mm (not to scale)
EVPAXBA1A
General dimension tolerance : ± 0.1
( )dimensions are reference dimensions.
This reference specifications are subject to change.
A
A'
B
C
0.7±0.15
0.245
П0.775
3.4
3
without the film
0.1 max.
(film)
Soldering thickness t=0.1±0.02
A
A'
B
C
1st operation
2nd operation
Circuit Diagram
A or/and A' shall be
used as common
terminal
2-3.6±0.05
2-2.5±0.05
Land pattern
(common terminal)
Land pattern plan
Except area
needs insulation
layer.
Land pattern
( Exposed)
˙ Recommended Reflow Soldering Conditions
˔ Embossed Carrier Taping
MAX.
245
220
Tape width=12.0 mm (A=12.0 mm)
Fan or Normal Temp.
Feeding hole
Chip pocket
D
EF
I
J
180
150
C
B
A' A
(Normal Temp.)
Part No.
EVPAX
Height
0.7
90±30
Soldering Time (s)
40±10
A
B
C
D
12.0±0.3 1.75±0.10 5.5±0.1 8.0±0.1
E
4.0±0.1
Tape running direction
t
Taping condition : Lack of products in the middle of taping should be
one MAX, but total quantity specified in the
specifications should be secured.
Peeling off strength of top tape : It should be within 0.2N to 1.0N at
165 degree in peeling off angle.
Joint of carrier tape : One joint per one reel may exist.
F
2.0±0.1
G
1.5±0.3
H
3.8±0.2
I
J
K
2.3±0.2 0.75±0.20 (10.25)
Unit: mm
t
0.30^{+–00..1150}
˔ Standard Reel Dimensions in mm (not to scale)
G
E
C
D
Item
A
B
C
D
E
Rate (mm) П380.0±2.0 П80.0±1.0 П13.0±0.5 П21.0±1.0 2.0±0.5
Item
F
G
Rate (mm) 13.5±1.0 17.5±1.0
A
F
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BOEPS
VTF
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B
TBGFUZ
DPODFSO
BSJTF
SFHBSEJOH
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CF
TVSF
UP
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VT
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Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
–2–
ɹ Panasonic Corporation 2016
ANCTB29E 201606-Fd