AXA2R Datasheet, PDF (2/8 Pages) Panasonic Semiconductor – Enhanced robustness and EMI resistance achieved by the laser-welded double-sided metal shell

AXA2R
To be transferred to Honda Tsushin kogyo Co.,Ltd. from October 1, 2009
PRODUCT TYPES
Product
name
Eject type
Card detection
switch
Card jump-out
prevention
function
Sockets for
SD memory
card
(R type)
Push-push
type
Available
Available
Not available
Mounting
type
Standard
mounting
type
Reverse
mounting
type
Standard
mounting
type
Reverse
mounting
type
Standoff
height
(mm)
0
1. 5
0
1.5
0
1.5
0
1.5
Part No.
Packing quantity
Inner carton
Outer carton
AXA2R73061∗
AXA2R73361∗
AXA2R63061∗
AXA2R63361∗
AXA2R73021∗
AXA2R73321∗
Asterisk “ ∗ ” mark on end of
Part No.;
P: 350 pieces (1 reel)
(Embossed tape package)
T: 35 pieces (1 tray)
(Tray package)
Asterisk “ ∗ ” mark on end of
Part No.;
P: 700 pieces (2 reels)
(Embossed tape package)
T: 700 pieces (20 trays)
(Tray package)
AXA2R63021∗
AXA2R63321∗
SPECIFICATIONS
1. Characteristics
Item
Rated Current
Electrical
characteristics
Contact resistance
Insulation resistance
Breakdown voltage
Mechanical
characteristics
Vibration resistance
Card insertion force
Card removal force
Lifetime
Insertion and removal
characteristics life of card
Environmental
characteristics
Ambient temperature
Storage temperature
Resistance to soldering
heat
Humidity tolerance
(mated condition)
Applicable memory card
Unit weight
Specifications
0.5 A/1 terminal
Signal contact portion: Max. 100mΩ (Initial)
Detection contact portion: Max. 150mΩ (Initial)
(Card detection and write protection detection)
Min. 1,000MΩ (Initial)
500V AC for 1 min.
Frequency: 10 to 55 Hz
Acceleration: 20.0 m/s² {2.0G}
No current interruption for more than 0.1 µs
Max. 40N
Min. 1N, Max. 40N
Insertion and removal life: 10,000 times
Contact resistance after testing:
Signal contact portion: Max. 100mΩ
Detection contact portion: Max. 150mΩ
(Card detection and write protection detection)
–25°C to +90°C
–40°C to +90°C (The allowable storage temperature is –40°C to +50°C
if unopened from original packaging)
Reflow soldering: peak temperature 250°C or less
Hand soldering: Soldering iron temperature 300°C, 5 sec. or less
Contact resistance:
Signal contact portion: Max. 100mΩ
Detection contact portion: Max. 150mΩ
(Card detection and write protection detection)
Insulation resistance: Min. 100 MΩ
SD memory card*¹
2.9g
Condition
Measured based on the HP4338B measurement
method of JIS C5402
Using 500V DC megger (applied for 1 min.)
Rated voltage is applied for one minute and check
for short circuit or damage with a detection current
of 1 mA.
Insertion and removal speed are at a rate of 600
times/hour or less.
No freezing or condensation in low temperatures
No freezing or condensation in low temperatures
Sockets (shell) surface temperature for using
infrared reflow soldering machine
MIL-STD-1344A, METHOD 1002
Temperature: 40±2°C, Humidity: 90 to 95%RH,
Test time: 500 hours
Note: *1. The above characteristics cannot be guaranteed when a card other than the specified ones is used.
2. Material and surface treatment
Portion
Signal contact
Detection contact
Retention solder tab
Material
Copper alloy
Stainless steel
Surface
Contact portion: Ni plating on base, PdNi plating + Au flash plating
Soldering portion: Ni plating on base, Au plating on surface
Contact/Soldering portion: Ni plating on base, Au plating on surface
Soldering portion: Ni strike, Partial Au plating
panasonic-electric-works.net/ac