ECJ-0EX1C104K Datasheet, PDF (14/25 Pages) Panasonic Semiconductor – PRODUCT SPECIFICATION FOR APPROVAL

CLASSIFICATION
SUBJECT
SPECIFICATIONS
Multilayer Ceramic Chip Capacitor
Common Specification ( Precautions for Use)
should be carefully determined.
No.
151S-ECJ-SS009E
PAGE
5 of 10
DATE _{1 Apr, 2005}
3. Precautions for Assembly
3- 1.Storage
(1) The Capacitors shall be stored under 5 - 40℃ and 20 - 70%RH, not under severe conditions of high temperature
and humidity.
(2) If the storage place is humid, dusty, and contains corrosive gasses (hydrogen sulfide, sulfurous acid, hydrogen
chloride and ammonia, etc.), the solderability of the terminal electrodes may deteriorate.
Also, storage in a place subjected to heating or exposed to direct sunlight causes deformed tapes and reels of
taped version and/or components sticking to tapes, which results in troubles at the time of mounting.
(3) The storage period shall be within 6 months. Products stored for more than 6 months shall be checked their
solderability before use.
(4) The Capacitors of high dielectric constant series (Class 2, Characteristic B,X7R,X5R and F,Y5V) change in
capacitance with the passage of time, “Capacitance aging”, due to the inherent characteristics of ceramic
dielectric materials. The changed capacitance can be recovered by heat treatment to each initial value at the
time of shipping. (See 2. Operating Condition and Circuit Design, 2-1-7. Capacitance aging)
(5) When the initial capacitance is measured, the Capacitors shall be heat-treated at 150+0/-10℃ for 1 hour and
then subjected to ordinary temperature and humidity for 48±4 hours before measuring the initial value.
3- 2.Adhesives for Mounting
(1) The amount and viscosity of an adhesive for mounting shall be such that the adhesive shall not flow off on the
land during it’s curing.
(2) If the amount of adhesive is insufficient for mounting, the Capacitor may fall after or during soldering.
(3) If the adhesive is too low in its viscosity, the Capacitors may be out of alignment after or during soldering.
(4) Adhesives for mounting can be cured by ultraviolet or infrared radiation. In order to prevent the terminal
electrodes of the Capacitors from oxidizing, the curing shall be dune at conditions of 160℃ max., for 2 minutes
max.
(5) If curing is insufficient, the Capacitor may fall after or during soldering. Also insulation resistance between
terminal electrodes may deteriorate due to moisture absorption. In order to prevent these problems, the curing
conditions shall be sufficiently examined.
3- 3.Chip Mounting Consideration
(1) When mounting the Capacitors/components on a PC board, the capacitor bodies shall be free from excessive
impact loads such as mechanical impact or stress in the positioning, pushing force and displacement of vacuum
nozzles at the time of mounting.
(2) The maintenance and inspections for Chip Mounter must be performed regularly.
(3) If the bottom dead center of the vacuum nozzle is too low, the Capacitor is cracked by an excessive force at the
time of mounting.
The following precautions and recommendations are for your reference in use.
(a) Set and adjust the bottom dead center of the vacuum nozzles to the upper surface of the PC board after
correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle at the time of mounting to 1 to 3 N in static load.
(c) For double surface mounting, apply a supporting pin on the rear surface of the PC board to suppress the
bending of the PC board in order to minimize the impact of the vacuum nozzles. The typical examples are
shown in the table below.
(d) Adjust the vacuum nozzles so that their bottom dead center at the time of mounting is not too low.
(4) The closing dimensions of positioning chucks shall be controlled and the maintenance, checks and replacement
of positioning chucks shall be regularly performed to prevent chipping or cracking of the Capacitors caused by
mechanical impact at the time of positioning due to worn positioning chucks.
(5) Maximum stroke of the nozzle shall be adjusted so that the maximum bending of PC board does not exceed
0.5mm at 90mm span. The PC board shall be supported by means of adequate supporting pins.
Note ;