ERA-3YEB562V Datasheet, PDF (10/10 Pages) Panasonic Semiconductor – PRODUCT SPECIFICATION FOR APPROVAL

Subject
Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION
Part No.
ERA3
Spec. No.
151-SRA-E102R
10－9
<Test Methods> _{Carrier tape}
14.3.2 Quantity in Taping: 5000 pcs. /reel
Peeling direction
10 ^o
Top tape
14.3.3 Tape packaging
(1) Resistance side shall be facing upward.
(2) Chip resistor shall not be sticking to top tape and bottom tape.
(3) Chip resistor shall be easy to take out from carrier tape and chip hole or sprocket hole
shall not have flash and break.
14.4 Outer Packaging
Quantity: 20 reels (Max. 100,000pcs.)
Tape
Marking
* When taping shall not reach Max. or quantity, the remaining empty space shall be buried
with buffer material.
* When the quantity shall be few, alternative packaging methods may be used. No problem
must occur during the exportation of the product.
14.5 Marking (Label)
Items listed below shall be displayed.
(1) Side of reel (Marking shall be on one side)
1)Part name, 2)Part number, 3)Quantity, 4)Lot number, 5)Maker name, 6) Production country
(2)Packaging box
1)Customer name, 2)Part name, 3)Part number, 4)Customer part number, 5)Quantity.
6)Maker name, 7)Production country
Panasonic Electronic Devices Co., Ltd.