PAN1323 Datasheet, PDF (1/2 Pages) Panasonic Semiconductor – SERIES BLUETOOTH HIGH TEMPERATURE MODULES

New
Product
Introduction
NEW! PAN1323 SERIES BLUETOOTH^® HIGH TEMPERATURE MODULES
Three Standards, One Small Module!
One highly flexible RF Module, three popular standards: Bluetooth Classic,
Bluetooth Low Energy and ANT™. Panasonic introduces the NEW PAN1323
Series Triple Mode RF Module with embedded antenna. The PAN1323 Series
provides easily integrated Bluetooth Version 4.0 and ANT connectivity into new
and current designs by removing RF design and certification barriers from the
development of the application. Gain unprecedented access using this three
mode gateway module that can connect 14 Million ANT n_P odes to over 3 Billion
Bluetooth nodes. Use Bluetooth EDR to manage large dataⁱ requirements while
Cut the Cable ^TM
taking advantage of extraordinary battery life using ultra lower network technology
found in Bluetooth Low Energy and ANT for small data loads.^{Bluetooth-Module PAN1450}
Designers can reduce the size and cost of applications using Panasonic’s unique,
tiny footprint technology. Just 85.5 mm², this family of modules are designed to ^{OUTLINES - ENW89803J}
accommodate PCBs with pad pitch of 1.3mm with as little as two layers for easy The PAN1450 provides wireless interface per the BT 1.2
specification. Interoperability and BT compliance testing have
been completed for the BT Chip ZV4301 from Zeevo, Inc. to
implementation and manufacturing. PAN1323 Series Modules have a Bluetooth facilate rapid time-to-market.
The BT Chip incorporates a widely popular 32-bit ARM7TDMI^TM
CPU core with sufficient bandwidth to support a wide range of
subsystem, FCC, CE, (ETSI) and IC certifications.
embedded µController applications and the module provides
full ARM7 software development access.
The PAN1450 is manufactured in a 13,4 x 18,7 x 2,2 mm³
SMD package and the only external component needed is an
50 ohm antenna.
Any customizations for the software can be handled
The NEW PAN1323 Series is based upon Texas Instrument’s CC256x integrated circuits and ^{with our recommended partners.} uses a host controlled interface
(HCI), a cost effective and flexible means to implement a Bluetooth network. H^FEAC^TURI^Er^Seduces BOM cost by eliminating redundant
Overview
processing
capacity
and
giving
designers
the
flexibility
to
work
with
a
controller of their choosing, - Inquiry results with RSSI (1.2)
- Adaptive frequency hopping (AFH) enabled (1.2)
as
the
stacks
reside
- High throughput (>600 kbps)
and
execute
on
the
application’s
host
processor.
The
PAN1323
Series
is pad compatible - Hold-, Park- and Sniffmode
- Up to 128 bit encryption
with
Panasonic’s
PAN1325A,
- Audio capability on an SCO channel
PAN1326
and
PAN1327
Series.
A
single
PCB
layout
allows
the
flexibility
of
different protocol functionality - Support for very low power modes - sleep and deep sleep
- All bluetooth data rates (up to 57,6/723,2Kbps)
implemented
with
only firmware.
Product Performance:
• A Single Module for Three Standards: Bluetooth Classic,
Bluetooth Low Energy and ANT™.
o Bluetooth Version 4.0
User Interfaces
- Full-speed USB version 2.0 compliant
- Programmable baud rate UART (9,6 Kbps - 921,6 Kbps)
- Debug UART (DUART)
- 16 General Purpose I/O‘s (interruptible)
- PCM audio (1 channel)
- SPI and JTAG interface
Radio Features
OOTH ^QUAL
• Easily Integrates to Texas Instruments’ MSP430 - High sensitivity design (-86 dBm typ.)
- Integrated RF shield
B01839
and Stellaris ARM7 Controllers - Class 2 module (0dBm typ. output power)
- One antenna port
PRODUCT
Design and Specifications are subject to change without notice. Ask the factory for technical specifications before purchase and/or use. If there is any doubt
regarding the safety of this product, kindly inform us immediately for technical consultation.
PAN1450 Rev. A
• Small Footprint: 9mm x 9.5mm x 1.8mm
o ANT™ is a wireless sensor network protocol
• Fully Certified, Bluetooth v4.0, FCC, CE and IC
designed for ultra-low power applications
• Complete Development Environment
o Bluetooth Low Energy average power consumption
• 100% Footprint Compatible with PAN13xx Series
is about 1 uA.
• Industrial Temperature Rating -40ºC to +85 ºC
• Cost Effective and Flexible HCI Interface
• Supports All Bluetooth Profiles
• Extraordinary Range with10 dbm of Tx Power
• Compatible with 14 Million Deployed ANT Nodes
PAN1323 Part Number:
Part Numbers
Description
ENW–89842A2KF Bluetooth, PAN1323 , Triple Mode with Antenna
Development and Evaluation Part Numbers:
Part Numbers
Description
ENW-89825A2JF PAN1323ETU, Development Module for PAN1315, PAN1316, PAN1317, PAN1325, PAN1326, PAN1327
EVAL_PAN1323 EVAL_PAN1323, Development Kit for PAN1315, PAN1316, PAN1317, PAN1325, PAN1326, PAN1327
The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by
Panasonic Corporation of North America is under license. Other trademarks and trade names are those of their respective owners.
www.panasonic.com/rfmodules
[e-mail]
1-800-344-2112
Copyright © 2013 Panasonic Corporation of North America.
All Rights Reserved. Specifications are subject to change without notice.
PAN13xx High Temp Line Extension, FY12-160-XXX