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PAN1311 Datasheet, PDF (1/2 Pages) Panasonic Semiconductor – Bluetooth-Module
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Cut the Cable TM
Bluetooth-Module PAN1311
(Picture shows similar module)
OUTLINES - ENW89810J5CF
Now you can integrate Bluetooth very easy in your final
product, with the PAN1311-SPP as a full Bluetooth system
solution.
In comparison to our pin compatible HCI solution (PAN1310),
there is no longer a powerful host needed.
The PAN1311 is manufactured in a 11,6 x 8,7 x 1.8 mm³ SMD
LGA package with shielded case and will be qualified to the
Bluetooth 2.0 standard.
Due to a very low price PAN1311 is well suited for units
produced in all quantities, with the simple AT command set
you are able to integrate PAN1311 into your application.
This module follows the national and international
regulations, e.g. EMC, Safety, EN300328, FCC.
FEATURES
General
- Supported Profiles: RFCOMM, SPP device A and B
- Complete Bluetooth 2.0 + EDR solution
- Ultra low power design
- Temperature from -40°C to +70°C, optional +85°C (Industrial Range)
- No external components except antenna is needed
- Integrates ARM7TDMI, RAM and patchable 256k EEPROM
(for device configuration data and application)
- On-module voltage regulator. External supply 2.7-3.6V
- Reference clock included
- Low power clock from internal oscillator or external low power clock
Interfaces
- 3.25 MBaud UART
- General purpose I/Os with interrupt and wake-up capabilities
- JTAG for boundary scan and debug
Bluetooth
- Scatternet with one slave role while still being visible
- Power control and RSSI
- Sniff mode, Adaptive Frequency Hopping and Quality of Service
ORDERING CODE
- PAN1311 with SPP and max. +70°C ENW89810J5CF
- PAN1311 with SPP and max. +85°C (on request for higher demand)
Design and Specifications are subject to change without notice. Ask the factory for technical specifications before purchase and/or use. If there is any doubt
regarding the safety of this product, kindly inform us immediately for technical consultation.
PAN1311 Rev. B1
www.pedeu.panasonic.de
wireless@eu.panasonic.com
Hardware Status:
Mass Production