LN189M Datasheet, PDF (1/2 Pages) Panasonic Semiconductor – GaAlAs Infrared Light Emitting Diode

Infrared Light Emitting Diodes
LN189M
GaAlAs Infrared Light Emitting Diode
Light source for distance measuring systems
s Features
• High-power output, high-efficiency: P_O = 5.5 mW (typ.)
• Fast response and high-speed modulation capability: t_r, t_f = 20 ns (typ.)
• Infrared light emission close to monochromatic light: λ_P = 880 nm (typ.)
• Narrow directivity using spherical lenses; works well with optical
systems in auto focus systems
s Absolute Maximum Ratings T_a = 25°C
Parameter
Symbol Ratings
Unit
Power dissipation
P_D
160
mW
Forward current (DC)
I_F
90
mA
Pulse forward current ^*
I_FP
175
mA
Reverse voltage (DC)
V_R
3
V
Operating ambient temperature T_opr
−25 to +85
°C
Storage temperature
T_stg
−40 to +100
°C
Note) *: f = 10 kHz, Duty cycle = 25%
Unit: mm
1
0.4±0.1
Mark (Black)
, _0.6±0.1
0.3
,, _{,, Spherical lens}
, , _{φ0.4±0.03}
, 0.6±0.1
0.5±0.1
0.15
2
3.2±0.15
1.5±0.2
0.1 max.
1.0
2.2±0.15
1: Anode
2: Cathode
s Electro-optical Characteristics T_a = 25°C
Parameter
Symbol
Conditions
min typ max Unit
Radiant power
Peak emission wavelength
Spectral band width
Forward voltage (DC)
Reverse current (DC)
Rise time
Fall time
Half-power angle
P_O
I_F = 100 mA
3
mW
λ_P
I_F = 100 mA
880
nm
∆λ
I_F = 100 mA
50
nm
V_F
I_F = 100 mA
1.55 1.9
V
I_R
V_R = 3 V
10
µA
t_r
I_FP = 100 mA
20
ns
t_f
I_FP = 100 mA
20
ns
θ
The angle in which radiant intencity is 50%
20
°
Precautions for Use
[Airtightness] This product is not structured to provide a complete air seal. Therefore it cannxot be immersed in solutions for
purposes such as boiling tests or ultrasonic cleaning.
[Ability to withstand soldering heat]
The package of this product contains thermoplastic resin which has a limited ability to withstand heat. Therefore
this product cannot be put through automated soldering operations in which the ambient temperature exceeds
the specified temperature. The recommended soldering conditions are as follows.
] ^{· Temperature of soldering iron tip: 260°C or less}
· Soldering time
: 5 seconds or less
: 300°C or less
or _{: 1 second or less}
· Soldering position
: At least 2 mm away from lead base
[Ability to withstand chemicals]
If the transparent case requires cleaning, wipe it lightly using ethyl alcohol, methyl alcohol, or isopropyl alcohol.
If you plan to use other solvents, carefully check to make sure there are no problems such as a misshapen case or
a change in the condition of the case material.
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