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EXB-E10C271J Datasheet, PDF (1/2 Pages) Panasonic Semiconductor – Chip Resistor Networks
Chip Resistor Networks
Chip Resistor Networks
Type: EXBD
EXBE
EXBA
EXBQ
Features
● High density placing for digital signal circuits
· Bussed 8 or 15 resistors for pull up/down circuits
EXBD: 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitch
EXBE: 4.0 mm × 2.1 mm × 0.55 mm, 0.8 mm pitch
EXBA: 6.4 mm × 3.1 mm × 0.55 mm, 1.27 mm pitch
EXBQ: 3.8 mm × 1.6 mm × 0.45 mm, 0.5 mm pitch
· Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB
(“High density placing” is shown below)
● High speed mounting using conventional placing machine
● Reference Standard…IEC 60115-9, JIS C 5201-9, EIAJ RC-2130
● RoHS compliant
[High density placing]
Pull up resistors
VCC
Direct placement on the bus line
EXBE10C
VCC
EXBA10P
VCC
IC
IC
IC
IC
IC
IC
No through hole
Through holes
0.4 mm pitch
0.635 mm pitch
■ As for Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions,
Please see Data Files
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
X
B
E
1
0
C
1
0
3
J
Product Code
Thick Film
Resistor
Network
Dimension Code of
Chip Resistor Network
Code Inch Dimensions
D 1206 3.2 mm×1.6 mm
E 1608 4.0 mm×2.1 mm
A 2512 6.4 mm×3.1 mm
Q 1506 3.8 mm×1.6 mm
Number of
Terminals
10(EXBD,E,A)
16(EXBQ)
Circuit Configuration
Code Common Terminal Position
C
Center common circuit
(EXBD, EXBE)
Diagonal common circuit
P (Terminal 5 and Terminal 10)
(EXBA)
One side common circuit
P (Terminal 16)
(EXBQ)
Diagonal common circuit
E (Terminal 1 and Terminal 6)
(EXBA)
Resistance Value
The first two digits are
significant figures of
resistance value and
the third one denotes
the number of zeros
following.
Resistance
Tolerance
J ±5 %
Suffix for Special
Requirements
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Sep. 2014