ELJ-LA4R7KF Datasheet, PDF (1/7 Pages) Panasonic Semiconductor – 4. High Power Type PF, PE, PC, PA, PB, LC, LA

4. High Power Type PF, PE, PC, PA, PB, LC, LA
Fixed Inductors (Chip Inductors)
■ Features
˔ Low DCR and large current capability, suitable for power circuitry.
˔ Wire wound, resin molded chip inductor. (PC, PA, PB, LC, LA type)
˔ Unique Ceramic Core/Laser-cut technology (PF, PE type)
˔ Capable of being Re-flow or flow soldered.
˔ Wide line-up from 1005 to 4532 case sizes.
˔ Good for mounting.
˔ RoHS compliant
■ Recommended Applications
˔ AV equipment, Wireless communication equipment and various types of general electronic equipment.
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
&- +1"3,'
Packaging Design No.
Product code
Chip Inductors
Shape
PF 1005 (0402)
PE 1608 (0603)
PC 2520 (1008)
LC 2520 (1008)
PA 3225 (1210)
LA 3225 (1210)
PB 4532 (1812)
Size : mm (inch)
Inductance
1N5 1.5 nH
10N 10 nH
R22 220 nH
3R3 3.3 μH
470 47 μH
561 560 μH
Inductance tolerance
D
±0.3 nH
J
±5 %
K
±10 %
M
±20 %
F
Taping
˙Storage Conditions
˔ Package
: Normal temperature (–5 to 35 °C), normal humidity (85 %RH max.), shall not be exposed to
direct sunlight and harmful gases and care should be taken so as not to cause dew.
˔ Operating Temperature : –40 to +85 °C (PF, PE)
–20 to +85 °C (PC, PA, PB, LC, LA)
˙Storage Period
˔ Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation
of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the
passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt.
˙Packaging Methods, Soldering Conditions and Safety Precautions
Please see Data Files.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 Sep. 2012